田艳红科研成果

基本信息 教学/Teaching 科研/Research 论著/Publications 招生信息 桃李/Students 新闻/News ... 桃李/Students 新闻/News 新建主栏目 田艳红 教授 博士生导师 名称 哈尔滨工业大学长聘二级教授，现任先进焊接与连接国家重点实验室副主任。入选国家级高层次人才计划、国家优青，新世纪人才。主要从事电子封装技术与可靠性、柔性电子材料与器件方面的研究工作。 获得荣誉与学术兼职 名称 2020 国家级高层次人才 2015 国家优秀青年基金获得者 2013 教育部新世纪人才 2021 黑龙江省自然科学一等奖 2020 黑龙江省青年科技奖 2015 黑龙江省自然科学二等奖 2014 机械工业科学技术二等奖 2013 哈尔滨工业大学教学成果一等奖 2013 黑龙江省教学成果二等奖 2003 黑龙江省优秀博士毕业生 国际焊接学会（IIW）新兴微纳加工技术分会 主席 国际电子封装协会(IMAPS)会刊 JMEP 副主编 中国机械工程学会焊接分会 常务委员 中国电子学会电子制造与封装分会电子封装专委会 理事 中国航空学会计算与仿真分会委员 电子封装技术国际会议技术委员会共同主席 中国机械工业教育协会焊接分委员会 秘书长 《Electron》编委 焊接杂志社 常务编委 《材料科学与工艺》杂志 编委 《电子与封装》杂志 编委 教育及工作经历 名称 2013.12-至今 哈尔滨工业大学先进焊接与连接国家重点实验室 副主任 2013.12-2016.12 哈尔滨工业大学焊接技术与科学系 主任 2016.07-2017.07 加拿大滑铁卢大学 机电工程系 访问教授 2006.06-2006.09 美国马里兰大学 电子封装可靠性中心 访问学者 2004.08-2005.08 加拿大滑铁卢大学 机械系 博士后 2012.12-至今 哈尔滨工业大学 材料学院 教授 2006.01-2012.11 哈尔滨工业大学材料学院 副教授 2003.04-2005.12 哈尔滨工业大学材料学院 讲师 1999.09-2003.03 哈尔滨工业大学 材料学院 博士 讲授课程 名称 1.电子封装专业导论 本科生课程：专业导论是电子封装技术专业的基础课程。将介绍集成电路芯片的发展与制造（发明、发展里程碑、发展现状等）；各种电子元器件的结构与设计；电子封装材料分类、用途及发展趋势；电子封装互连、微纳制造、封装测试、可靠性与失效相关的知识；未来的电子封装技术；世界范围内与电子封装技术相关的研究院校与发展现状；电子制造行业对高级人才知识结构体系的需求等。对于新入学的一年级学生，通过本课程的学习激发对专业学习的兴趣与自觉性，为后续专业课学习打好基础。 2.微电子制造技术 本科生课程:微电子制造技术是电子封装技术专业的主干课程，培养学生掌握从事微电子设计、制造、封装测试必须具备的专业基本知识。课程教学目的如下：1) 了解微电子制造技术的发展历史及基本的发展规律；2) 熟悉半导体集成电路的基本制造过程，如扩散、光刻等方法的原理；3) 掌握微电子制造的基本原理，具有进行简单微电子制造工艺设计的能力。 3.微连接原理与方法 本科生课程:微连接是电子封装的核心技术，电子封装结构的发展依赖于微连接技术的进步。微连接原理与方法是电子封装技术专业的必修课程，其目的是使本专业学生了解微连接所涉及的材料、结构和性能要求的特殊性；掌握电子封装和制造中微互连技术的基本原理、工艺方法和应用；熟练掌握超声键合、微软钎焊、熔化微连接、胶接的基本原理和连接特性；理解电子封装中微连接失效机理、缺陷及检测、可靠性及质量控制方法；熟悉电子封装和制造中前沿互连技术的基本原理、工艺方法和应用，如纳米连接技术及纳米制造等。为学生今后在电子封装领域的工作和深造奠定坚实的基础。 4.微纳连接技术 研究生课程：本课程将从材料加工和电子制造领域出发，使学生掌握微电子制造中的微纳连接技术方法和基础理论。了解最先进的微连接方法的原理、过程控制及界面冶金行为，明确激光超声无钎剂软钎焊方法氧化膜去除的原理、超声键合过程中超声对界面原子扩散的促进作用；通过钎料与材料之间界面电子结构，掌握润湿性和可钎焊性的基本原理；通过微连接界面微观组织的演变，了解微连接接头界面行为的尺寸效应；通过钎料合金中元素的迁移、界面间的相互影响，掌握微互连接头中的扩散动力学；掌握含有限晶粒的微连接接头的力学行为、裂纹尖端物理及扩展行为、力学行为的尺寸效应；掌握微互连接头中电迁移和锡须产生的基本原理、失效模式及最新研究进展；了解电子制造领域最前沿的纳米互连技术及发展趋势。 教学获奖 名称 1. 电子封装技术专业课程体系的研究与实践 2013年哈尔滨工业大学优秀教学成果一等奖 2. 电子封装技术新专业建设的研究与实践 2013年黑龙江省高等教育教学成果二等奖 教学论文 名称 1. 田艳红，刘威，王春青 构建电子封装技术专业本科生培养体系 哈尔滨工业大学学报（社会科学版），第13卷（增2），2011年12月 2. 田艳红，王春青 电子封装技术研究与教育机构十年发展, 电子工业专用设备, 2013年3月 3. 杭春进，田艳红，王春青，刘威，安荣，张威 加拿大滑铁卢大学产学合作培养模式概况与启示高教综合改革研究与实践论文集，黑龙江省高等教育学会编著，2012年4月 （获得黑龙江省高等教育学会优秀教育科研论文一等奖) 4. 修子扬，张蕊，田艳红，刘念. 高校大学生MOOC学习现状及影响因素研究. 提升高等教育质量(下册), 2015 5. 张威, 郑振，刘威，田艳红. 高校课程思政的探索与实践——以《电子封装与社会》为例. 高等教育现代化的实证研究(一),2019. 6. 王晨曦, 田艳红，刘威，张威，王春青. 电子封装专业大学生创新创业能力培养模式探索与实践. 电子工业专用装备，2020, 49(03). 7. 王晨曦, 安荣，郑振，田艳红. 《微纳加工技术》教学改革与创新能力培养浅谈. 科技创新导报，2020, 17(18). 8. 王晨曦, 杭春进，牛帆帆，刘威，田艳红. 国内外高校电子封装专业人才创新能力培养方案比较研究. 产业与科技论坛，2020, 10(09) 9.刘威, 杭春进, 田艳红, 张威, 安荣, 王晨曦, 王尚. 电子封装国际标准认证课程思政建设案例与实践. 活力, 2021, 7: 63-63(65) 10.王尚, 冯佳运, 张贺, 刘威, 田艳红. 集成电路学科建设背景下电子封装技术专业人才培养探索与实践. 电子与封装, 2023, 23(7): 70206 研究领域 名称 研究方向1：三维系统级封装互连与可靠性 超细间距巨量焊点阵列倒装芯片互连技术 三维封装硅通孔（TSV）互连高可靠键合技术 多场耦合（电-热-振动）三维系统级封装可靠性模拟技术与寿命预测 研究方向2：第三代半导体功率芯片封装 新概念纳米浆料互连材料开发和可控制备技术 功率芯片封装结构热管理及仿真技术 功率芯片封装多级互连技术及机理 功率芯片封装结构服役可靠性及失效机理 研究方向3：柔性电子材料与器件 纳米墨水（Nano Ink）合成及性能 多能量场纳米油墨打印、烧结过程物理行为 柔性电路极端环境下的长期工作稳定性和失效机理 高可靠柔性可穿戴器件、自发电器件及传感器件应用 科研获奖 名称 极端温度环境电子组装互连界面组织调控和可靠性 2021 黑龙江省自然科学一等奖 黑龙江省青年科技奖 2020 电子封装中的微连接基础问题研究，2015年黑龙江省自然科学二等奖 面向MEMS立体封装和组装微锡球激光键合工艺及设备 2014年机械工业科学技术二等奖 Interaction Kinetics between PBGA Solder Balls and Au/Ni/Cu Metallisation during Laser Reflow Bumping，2013欧洲Emerald最值得推荐论文奖 课题项目 名称 2023-2026 高密度陶瓷封装多物理场耦合互连焊点性能退化及寿命评估， NSFC-叶企孙联合基金重点项目 2023-2026 Chiplet封装可靠性机器学习寿命预测，部委课题 2023-2024 功率芯片封装纳米烧结及可靠性，行业合作项目 2023-2025 Chiplet封装可靠性，行业合作项目 2023-2025 国产电子器件长期贮存可靠性寿命提升，行业合作项目 2022-2025 柔性自供电器件碳/金属飞秒激光异质连接机理及性能调控， NSFC面上项目 2018-2020 三维微系统封装超细引线微电阻点焊连接物理与可靠性，NSFC-NSAF联合基金项目 2016-2018 微纳连接理论与技术， NSFC 优青项目 2011-2013 3D封装芯片互连固液互扩散低温键合机理及可靠性，NSFC面上项目 2006-2008 纳米薄膜增强铜芯片超声键合性能的原理， NSFC青年基金项目 2013-2018 微-纳尺度材料连接界面交互作用机制及可靠性物理，教育部新世纪人才项目 2018-2022 科技部智能机器人领域重点专项课题 2018-2020 工信部创新发展工程重点专项课题 2018-2020 柔性电子材料与器件， 哈尔滨工业大学青年科学家工作室项目 2018-2020 高密度超细引线键合技术， 预研基金项目 2011-2015 三维组装垂直互连技术，预研基金项目 2010-2013 MEMS立体封装与组装技术，国家高技术研究发展计划项目 2003-至今 电子封装互连可靠性有限元模拟及失效分析，行业合作项目 2015-2020 极限低温环境钎料及焊点可靠性评估 行业合作项目 2020-2022 功率芯片封装纳米浆料烧结及可靠性 行业合作项目 2019-2022 物联网电子标签柔性电路打印及性能 行业合作项目 2020-2022 射频芯片封装互连工艺及可靠性 行业合作项目 2021-2022 国产系统级封装SiP器件可靠性有限元模拟 行业合作项目 著作 名称 Yanhong Tian 英文著作《Microjoining and Nanojoining》Chapter 12: Laser Soldering 英国Woodhead出版社 2008 田艳红《焊接技术路线图》第13章 机械工业出版社 2016 田艳红《中国焊接1994-2016》第10章 机械工业出版社 2017 田艳红《China Welding 1994-2016》 Chapter 10 机械工业出版社 2017 田艳红 译著《微连接与纳米连接》机械工业出版社 2011 田艳红 主编 《微纳连接原理与方法》哈尔滨工业大学出版社 2023（工信部十四五规划教材） 代表性论文 名称 Jiayue Wen, Shang Wang*, Jiayun Feng, Jingxuan Ma, He Zhang, Peng Wu, Geng Li, Zhuohuan Wu, Fanzhou Meng, Longqiu Li, Yanhong Tian*. Recent progress in polyaniline-based chemiresistive flexible gas sensors: design, nanostructures, and composite materials. Journal of Materials Chemistry A, 2024, 10.1016/j.sna.2024.115075. Guifang Zeng, Qing Sun*, Sharona Horta, Shang Wang*, Xuan Lu, Chaoyue Zhang, Jing Li, Junshan Li, Lijie Ci, Yanhong Tian*, Maria Ibánez, Andreu Cabot*. A Layered Bi2Te3@PPy Cathode for Aqueous Zinc Ion Batteries: Mechanism and Application in Printed Flexible Batteries. Advanced Materials, 2024, 36(1): 2305128 (Frontispiece). Zicheng Sa, Shang Wang*, Jiayun Feng, Jiayue Wen, Xudong Liu, Yanhong Tian*. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn. Journal of Materials Research and Technology, 2023, 26: 9112-9126. Shang Wang, Guifang Zeng, Qing Sun*, Yan Feng, Xinxin Wang, Xinyang Ma, Jing Li, He Zhang, Jiayue Wen, Jiayun Feng, Lijie Ci*, Andreu Cabot*, Yanhong Tian*. Flexible Electronic Systems via Electrohydrodynamic Jet Printing: A MnSe@rGO Cathode for Aqueous Zinc-Ion Batteries. ACS Nano, 2023, 17(14): 13256–13268. Qing Sun, Guifang Zeng, Jing Li, Shang Wang*, Marc Botifoll, Hao Wang, Deping Li, Fengjun Ji, Jun Cheng, Huaiyu Shao, Yanhong Tian*, Jordi Arbiol, Andreu Cabot*, and Lijie Ci*. Is Soft Carbon a More Suitable Match for SiOx in Li-Ion Battery Anodes?. Small, 2023, 19(37): 2302644 （Frontispiece）. Qing Sun, Jing Li, Maoxiang Yang, Shang Wang*, Guifang Zeng, Hongbin Liu*, Jun Cheng, Deping Li, Youri Wei, Pengchao Si, Yanhong Tian*, and Lijie Ci*. Carbon Microstructure Dependent Li-Ion Storage Behaviors in SiOx/C Anodes. Small, 2023, 19(25): 2300759 （Cover Picture）. He Zhang, Jiayun Feng, Fangyuan Sun, Dongyan Zhou, Ge Cao, Zhuohuan Wu, Shang Wang, Fengyu Su*, Yanqing Tian*, Yanhong Tian*, An electrochemically stable Ag@Au–Co core-shell nanowire network-based transparent conductor for flexible self-powered Zn-based electrochromic smart devices, Materials Advances, 2023, 4, 995-1004. He Zhang, Fangyuan Sun, Jiayun Feng, Huan Ling, Dongyan Zhou, Ge Cao, Shang Wang, Fengyu Su*, Yanqing Tian*, Yanhong Tian*, A stable, self-regulating, flexible, ITO-free electrochromic smart window for energy-efficient buildings, Cell Reports Physical Science, 2022, 3(12):101193. Jiayun Feng, Yanhong Tian*, Sumei Wang, Ming Xiao, Zhuang Hui, Chunjin Hang, Walter W. Duley, Y. Norman Zhou*, Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor, Journal of Materials Science & Technology, 2021, 84,139-146. He Zhang, Yanhong Tian*, Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device, Chemical Engineering Journal，2021 Jikai Xu, Zhihao Ren, Bowei Dong, Xinmiao Liu, Chenxi Wang*, Yanhong Tian*, Chengkuo Lee*, Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy, ACS Nano, 2020, 14, 9, 12159–12172. Jikai Xu, Chenxi Wang*, Xiaoliang Ji, Qi an, Yanhong Tian*, Tadatomo Suga, Direct bonding of high dielectric oxides for high-performance transistor applications, Scripta Materiala, 2020, 178, 307-312. Jiayun Feng , Ming Xiao, Zhuang Hui, Daozhi Shen, Yanhong Tian*, Chunjin Hang, Walter W. Duley, and Norman Y. Zhou*, High-Performance Magnesium–Carbon Nanofiber Hygroelectric Generator Based on Interface-Mediation-Enhanced Capacitive Discharging Effect, ACS Applied Materials & Interfaces, 2020, 12, 21, 24289–24297. He Zhang, Yanhong Tian*, Shang Wang, Yilong Huang, Jiayue Wen, Chunjin Hang, Zhen Zheng, Chenxi Wang, Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device,Chemical Engineering Journal, 2020, 399(20),125075. He Zhang, Shang Wang, Yanhong Tian* , Yubin Liu, Jiayue Wen, Yilong Huang, Chunjin Hang, Zhen Zheng, Chenxi Wang, Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films, Chemical Engineering Journal, 2020, 399(6),124495. Yilong Huang, Yanhong Tian*, Chunjin Hang, Yubin Liu, Shang Wang, Miaomiao Qi, He Zhang, Jie Zhao*.Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters [J]. ACS Applied Materials & Interfaces, 2019, 11 (24): 21850-21858. Jiayue Wen, Yanhong Tian*, Changxiang Hao, Shang Wang, Zhipeng Mei, Weizhen Wu, Junyi Lu, Zhen Zheng, Yanqing Tian*. Fabrication of high performance printed flexible conductors by doping of polyaniline nanomaterials into silver paste. Journal of Materials Chemistry C, 2019,7: 1188. Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, Yilong Huang, Chao Liao. Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters, Composites Science and Technology, 2019, 174: 76-83 Yilong Huang, Yayun Liu, Kareem Youssef, Kwing Tong, Yanhong Tian*, Qibing Pei*. A solution processed flexible nanocomposite substrate with efficient light extraction via periodic wrinkles for white organic light-emitting diodes, Advanced Optical Materials, 2018: 1801015 Ruyu Tian; Chunjin Hang; Yanhong Tian*; Liyou Zhao. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Materials Science ＆ Engineering A,V709, 2018, P 125-133 Ruyu Tian, Yanhong Tian*, Chenxi Wang, Liyou Zhao. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures. Materials Science ＆ Engineering A, v 684, p 697-705, 2017 Su Ding,Jinting Jiu,Yue Gao,Yanhong, Tian*,Teppei Araki. One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices. ACS Appl. Mater. Interfaces，2016 邀请报告 名称 1. 报告题目: 电子封装中的微纳连接技术及其在柔性电子中的应用, CMST 10th International Conference of Micro-Nano Technology, Wuhan, China, Oct 11-14, 2019 （中国微米纳米技术学会第21届学术年会暨第十届国际会议，中国武汉） 2. 报告题目: 微纳连接新方法及关键科学问题，第三届“轻质材料焊接与连接基础研究”中青年学者论坛， 济南，2018-11-14至2018-11-16 3. 报告题目: Fast Fabrication of Copper Nanowire Conductors by a Photonic Sintering Technique, The 3rd International Conference on Nanojoining and Microjoining, Ontario, Sep 25-28, 2016（第3届纳连接与微连接国际会议，加拿大安大略） 4. 分会邀请报告： Mechanism of Low Temperature Cu-In Solid-Liquid Interdiffusion Bonding in 3D Package, 13th International Conference on Electronic Packaging Technology,Guilin,China, Aug.12-14,2012(第13届电子封装国际学术会议，中国桂林。作为分会主席参与组织学术会议) 5. 报告题目：Morphologies of Cu6Sn5 intermetallic compounds on Single Crystal Cu Substrates. International Conference on Najoining and Microjoining，Dec 2-6,2012 Beijing,China (第1届微纳连接国际学术会议，中国北京。作为分会主席参与组织学术会议) 6. 报告题目：Morphologies and Grain Orientations of Cu6Sn5 in Sn3.0Ag0.5Cu/Cu Solder Joint. 4th International Conference on Brazing and Soldering, Las Vegas, USA, April 23-25,2012(第4届钎焊国际会议，美国拉斯维加斯) 7. 报告题目：Recent Research Advances in Nanojoining and Microjoining in HIT, Workshop on Nanojoining and Microjoining, Waterloo, ON, Canada,Nov,20-23, 2011(加拿大滑铁卢大学微纳连接研讨会) 8. 报告题目：Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints," 12th International Conference on Electronic Packaging Technology, Shanghai, China, Aug.2-6,2011 (第12 届电子封装国际学术会议，中国上海。作为分会主席参与组织学术会议) 9. 报告题目：Ultrasonic Bondability and Antioxidation Property of Ti/Cu/Ag Metallization on Si Substrate. 12th International Conference on Electronic Packaging Technology, Xi'an, China, Aug.19-22,2010 (第11届电子封装国际学术会议，中国西安。作为分会主席参与组织学术会议) 10. 报告题目：Characterization of Ag Nanofilm Metallization on Copper Chip Interconnect and Its Ultrasonic Bondability. 10th International Conference on Electronic Packaging Technology，July 26-28, 2009，Beijing,China (第10届电子封装国际学术会议，中国北京。作为分会主席参与组织学术会议) 11. 报告题目：Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder Joints on Cu Pads with Differeint Solder Volumes. ICEPT-HDP 2008, Shanghai, July 28-31,2008 (第9届电子封装国际学术会议，中国上海) 12. 报告题目： Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process, ICEPT-HDP，Shanghai 2007(第8届电子封装国际学术会议，中国上海) 专利 名称 1. 田艳红,张贺,王尚,吴炳英. 一种柔性电致变色薄膜及其制备方法. ZL 201911295935.6 2. 田艳红,张贺,王尚. 一种铜金合金纳米线柔性透明导电薄膜的制备方法. ZL 202110169586.4 3. 田艳红,王尚,杭春进,郑振. 一种金属纳米墨水的原位电还原反应连接方法及其在印刷电子器件中的应用. ZL 201910860066.0 4. 田艳红,王尚,吴炳英,杭春进,郑振. 一种镍镀层辅助的高强度复合电刷的制备方法. ZL 202010635647.7 5. 田艳红,王尚,杭春进,郑振. 一种水系纳米墨水及配制方法. ZL 201910860080.0 6. 田艳红,王尚,孔令超. 一种防止工件损伤的电阻焊方法. ZL 201910901597.X 7. 田艳红,江智,文嘉玥. 铜/银核壳纳米颗粒低温烧结复合焊膏及其制备方法. ZL 201510663510.1 8. 田艳红,刘宝磊,孔令超,杭春进,王春青.热-超声-电磁复合场调控金属间化合物生长实现芯片高可靠立体互连的方法. ZL201310530610.8 9. 田艳红,杭春进,刘威,王春青,吴伟伟. 立体组装垂直互连中的双面凸点转接板及其制作方法. ZL 201218004390.1 10. 田艳红,刘宝磊,王春青,杭春进,孔令超. 高频电磁感应加热重熔实现板级三维组装互连的方法. ZL 201318007896.2 11. 田艳红,刘宝磊,孔令超. 热-超声-电磁多场复合再流焊方法. ZL 201310672744.3 12. 王春青,田艳红,吴伟伟,刘宝磊. 一种垂直互连双面凸点转接板制造过程中的辅助装置. 201318007895.8 13. 孔令超, 田艳红,王春青. 检测电路板焊点可靠性的红外测温检测法. ZL 201110033883.2 14. 孔令超,田艳红,王春青. 采用红外多点测温热阻法检测电路板焊点可靠性的检测系统. ZL201110033879.6 15. 王春青,田艳红,孔令超. 双束激光辅助LED芯片与热沉直接键合的方法. ZL 200710144639.7 16. 孔令超,王尚,田艳红. 一种电阻焊工件快速对准夹具. ZL 201910925646.3 17. 王晨曦,许继开,田艳红,刘艳南,曾小润,王春青. 一种辅助手动晶圆键合装置. ZL 201610337329.6 18. 王晨曦,许继开,田艳红,王春青.一种压力可调可用于气体保护下的热压键合夹具, 专利号：ZL201610185303.4 19. 王晨曦,许继开,田艳红,黄圆,石成杰.一种利用水蒸气辅助及紫外光活化键合装置及方法, 专利号：ZL201610255681.5 20. 刘威,王春青,田艳红. 一种采用多层微米、亚微米薄膜快速制备可高温服役全IMC微焊点的方法. ZL 201510235060.6 21. 王晨曦,许继开,田艳红,刘宝磊. 一种利用半导体制冷片进行高低温可控晶圆键合的方法,专利号：ZL201511011062.3 22. 刘威,王春青,田艳红,安荣,郑振. 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法.ZL 201510553532.2 23. 刘威,王春青,田艳红,安荣,杭春进. 一种可提高导线与焊盘焊接效率及可靠性的手工电烙铁头. ZL 201210516546.3 24. 王春青,李彬,田艳红,王宁,孔令超,吴伟伟. 一种钙钛矿结构陶瓷溶胶的制备方法. ZL 201110355061.6 25. 王春青,刘威,田艳红,孔令超. 扫描式薄膜图形激光转移方法. ZL 201110103942.9 26. 王春青, 孔令超, 田艳红. 单束激光辅助LED芯片与热沉直接钎焊的方法. ZL200710144640.X 27. 王春青, 孔令超, 田艳红.LED芯片与热沉直接封装的散热组件及其制造设备和方法.ZL 200710144581.6 28. 安荣,孔令超,王春青,田艳红,郑振. 硅/金属含能调制膜诱导反应制备高温服役低电阻接头的方法. ZL 201410113951.X 29. 王春青,杨磊,刘威,田艳红. 基于钎料球激光重熔工艺的MEMS自组装方法. ZL 201110439730.8 30. 王春青,杨磊,刘威,田艳红. 植球键合机的锡球供料装置. ZL 201010511370.3 31. 王春青,杨磊,刘威,田艳红. 面向MEMS立体封装和组装的锡球凸点键合及质量检测方法.ZL 201010222496.9 32. 王晨曦,周诗承,方慧,戚晓芸,田艳红,杭春进. 一种在可降解金属表面制备聚多巴胺涂层的方法. ZL 202011227585.2 33. 王晨曦,许继开,方慧,周诗承,田艳红. 一种利用先真空紫外光再氮等离子体两步活化直接键合铌酸锂和硅晶片的方法. ZL 201811005392.5 34. 王晨曦,许继开,张闰勃,黄博妍,田艳红. 一种利用等离子体活化直接键合氧化锆和三氧化二铝的方法. ZL 201910761248.2 35. 刘威,吴卓寰,王春青,安荣,郑振,田艳红. 适用于高功率电子器件或组件的电磁感应快速连接方法. ZL 202110655360.5 36. 王晨曦,方慧,厉道远,黄博妍,周诗承,田艳红. 一种基于静电纺丝制备掺杂氧化银的氧化锰纳米线网络的方法及其在催化分解甲醛中的应用. ZL 201910750842.1 37. 王晨曦,许继开,戚晓芸,籍晓亮,刘艳南,田艳红,王春青. 一种交叉十字键合法测量晶片键合强度的方法及夹持装置. ZL 201710420121.5 38. 王晨曦,戚晓芸,闫寒,周诗承,陈航,康秋实,田艳红. 一种基于莫尔条纹的晶圆键合对准系统及方法. ZL 202110645471.8 39. 王晨曦,王特,方慧,周诗承,牛帆帆,杭春进,田艳红. 一种银纳米焊膏低温无压烧结方法. ZL 201910346433.5 40. 王晨曦,许继开,康秋实,聂啸,卢达洲,吴斌,戚晓芸,田艳红. 一种利用水蒸气预处理表面的等离子体活化直接键合方法. ZL 201810380619.8 41. 王晨曦,许继开,王源,吴斌,康秋实,王特,赵珈辉,李义邦,田艳红. 一种利用紫外光活化键合叠加式放置的玻璃与其他材料的方法. ZL 201910860066.0 期刊论文 名称 1. Xiaoyun Qi, Shicheng Zhou, Hui Fang, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*,One-step PDA coating strategy on pure Zn for blood-contacting engineering,Journal of Materials Science & Technology,Volume 123,2022,78-91.2. Shuai Wang, Jiayun Feng, Shang Wang, Kaifeng Wang, Muying Yu, Yanhong Tian*, Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate, Materials Letters, Volume 325, 2022.3. 张贺,冯佳运,丛森,王尚,安荣,吴朗,田艳红*.62Sn36Pb2Ag组装焊点长期贮存界面化合物生长动力学及寿命预测[J/OL].工程科学学报:1-8[2022-11-21].4. Rong An*, Xiguang Zhang, Jingman Shen, Wanyu Jiang, Xunchun Wang, Wei Zhang, Wei Liu*, Yanhong Tian, Chunqing Wang, Physics-of-degradation-based life prediction of solder interconnects of long-life solar arrays in low-earth orbit, Solar Energy, Volume 248, 2022, 196-209.5. Qing Sun, Maoxiang Yang, Guifang Zeng, Jing Li, Zhibiao Hu, Deping Li*, Shang Wang*, Pengchao Si*, Yanhong Tian, Lijie Ci*, Insights into the Potassium Ion Storage Behavior and Phase Evolution of a Tailored Yolk–Shell SnSe@C Anode. Small 2022, 18, 2203459.6. 张贺,冯佳运,丛森,王尚,安荣,吴朗,田艳红*.表面贴装锡基焊点长期贮存可靠性及寿命预测研究[J].电子与封装,2022,22(07):5-10.7. 王大为,董阳平,田艳红,毕云杰,严明*.活性气氛对金属材料激光增材制造的作用机制[J].中国激光,2022,49(14):87-107.8. Wei Liu, Rong An*, Ying Ding, Chun-Qing Wang, Yan-Hong Tian & Kun Shen, Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Met. 41, 1983–1988 (2022).9. Weiwei Zhang, Sen Cong*, Jihua Fang & Yanhong Tian ,Relationship between dynamic resistance and welding quality during resistance spot welding for micron AuNi9 wire. Int J Adv Manuf Technol 120, 6605–6616 (2022).10. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Yanhong Tian, Chenxi Wang*, Hybrid Plasma Activation Strategy for the Protein-Coated Magnesium Implants in Orthopedic Applications,Adv. Mater. Interfaces 2022, 2101724.11. 张贺,王尚,冯佳运,马竟轩,胡轩溢,冯艳,田艳红*.金属/非金属纳米线连接及应用研究进展[J].机械工程学报,2022,58(02):76-87.12. 王晨曦*,戚晓芸,方慧,康秋实,周诗承,许继开,田艳红.紫外光活化低温键合研究进展[J].机械工程学报,2022,58(02):122-135.13. 吴卓寰,刘威*,温志成,王一平,田艳红,王春青.微米铜银复合结构与纳米银混合连接材料制备与高频感应快速烧结方法研究[J].机械工程学报,2022,58(02):26-33.14. 李胜利,任春雄,杭春进*,田艳红,王晨曦,崔宁,蒋倩.极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变[J].机械工程学报,2022,58(02):291-299.15. 撒子成,王尚,冯佳运,马竟轩,张宁,于广良,梁洁玫,田艳红*.SiP器件组装焊点形态预测及其随机振动可靠性仿真研究[J].机械工程学报,2022,58(02):276-283.16. 李胜利,牛飘,杭春进*,田艳红,崔宁,蒋倩.极端温度环境Sn基焊点本构方程的研究进展[J].机械工程学报,2022,58(02):236-245.17. Hui Fang, Xiaoyun Qi, Shicheng Zhou, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*, High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-co-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent Applications, ACS Appl. Mater. Interfaces 2022, 14, 2, 3536–3550.18. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Chenxi Wang*, Yanhong Tian, A multifunctional osteogenic system of ultrasonically spray deposited bone-active coatings on plasma-activated magnesium, Journal of Magnesium and Alloys, 2021.19. Wei Liu*, Zhicheng Wen, Sizhen Chen, Chunqing Wang*, Rong An, Wei Zhang, Xinming Wang, Junjie Wang, Yanhong Tian, Preparation and characterization of self-assembled ZnO nanowire devices: nanowire strain sensor and homogeneous p–n junction, 2021 Nanotechnology, 32, 495604.20. Yang Dongsheng, Yilong Huang, Yanhong Tian*. Microstructure of Ag Nano Paste Joint and Its Influence on Reliability. Crystals. 2021; 11(12):1537.21. 王尚,马竟轩,杨东升,徐佳慧,杭春进,田艳红*.射频器件超细引线键合射频性能仿真[J].焊接学报,2021,42(10):1-7%2B97.22. Wei Liu, Zhicheng Wen, Jiahui Xu, Xinming Wang, Rong An*, Chunqing Wang*, Zhen Zheng, Wei Zhang, Yanhong Tian,Rapid fabrication of Cu/40-μm thick full Cu3Sn/Cu joints by applying pulsed high frequency electromagnetic field for high power electronics,Materials Chemistry and Physics,Volume 276,2022,125386.23. 王尚,王凯枫,张贺,徐佳慧,杨东升,杭春进,田艳红*.射频器件超细引线键合工艺及性能研究[J].机械工程学报,2021,57(22):201-208.24. Xuanyi Hu, Shang Wang*, He Zhang, Yiping Wang, Chunjin Hang, Jiayue Wen & Yanhong Tian*. Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters. J Mater Sci: Mater Electron 32, 27373–27383 (2021).25. Sen Cong, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, Yanhong Tian*, Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test, 2021 Mater. Res. Express 8 106301.26. Shang Wang, He Zhang, Chunjin Hang*, Jiayun Feng, Zicheng Sa, Yue Li, Weiwei Zhang, Yanhong Tian*, Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process, Materials Characterization,Volume 180,2021,111401.27. He Zhang, Yanhong Tian*, Shang Wang*, Jiayun Feng, Chunjin Hang, Chenxi Wang, Jingxuan Ma, Xuanyi Hu, Zhen Zheng, Huijuan Dong, Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device, Chemical Engineering Journal, Volume 426, 2021,131438.28. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Ge Li, Tian Lu, Yanhong Tian, Peng He, Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture, ACS Appl. Mater. Interfaces 2021, 13, 32, 38866–38876.29. Yanliang Shan, Yunhui Mei, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Kim Shyong Siow, "Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 6, pp. 983-989, June 2021.30. Xiaoyan Yao, PanpanLu, YanhongTian, Guo-Quan Lu, YunhuiMei*, A 200 °C curable soft magnetic composite with high permeability and low core loss for power applications at >1 MHz, Journal of Magnetism and Magnetic Materials, 2021，535，168061.31. Jiayun Feng, Yanhong Tian*, Sumei Wang, Ming Xiao, Zhuang Hui, Chunjin Hang, Walter W. Duley, Y. Norman Zhou*,Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor, Journal of Materials Science & Technology, 2021, 84,139-146.32. Shang Wang, Yan Feng, He Zhang, Qiqi Peng, Yanhong Tian*. Highly stable and printable Ag NWs/GO/PVP composite ink for flexible electronics, Flexible and printed electronics, 2021.33. Shang Wang, He Zhang, Yue Li, WeiWei Zhang, Chunjin Hang, Yanhong Tian*.Transient Solid-Liquid interfacial Reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding, Materials Letters, 2021, 288(9).34. He Zhang, Shang Wang, Bingying Wu, WeiWei Zhang, Chunjin Hang, Yanhong Tian*.Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer, Micromachines, 2021, 12(1), 51.35. He Zhang, Shang Wang, Chunjin Hang, Yanhong Tian*.Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode, Welding in the world, 2021.36. 杨帆, 杭春进，田艳红*. 功率器件封装用纳米浆料制备及其烧结性能研究进展. 电子与封装，2021, 21(3).37. Hui Fang, Chenxi Wang*, Daoyuan Li, Shicheng Zhou, Yu Du, He Zhang, Chunjin Hang, Yanhong Tian, Tadatomo Suga. Fabrication of Ag@Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde, Journal of Materials Science & Technology, 2021.38. Yanliang Shan, Yunhui Mei*, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Kim Shyong Siow. Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 2156-3950.39. Ruyu Tian*, Yanhong Tian*,Yilong Huang,Dongsheng Yang, Cheng Chen, Huhao Sun. Comparative study between the Sn–Ag–Cu/ENIGand Sn–Ag–Cu/ENEPIG solder joints under extremetemperature thermal shock, Journal of Materials Science: Materials in Electronics ,2021,32,6890-6899.40. Yanhong Tian*, He Zhang, Chunjin Hang, Shang Wang, Jiayun Feng, Su Ding, Yilong Huang, Recent advances in metal nanowire based transparent conductive films: Fabrication and applications, Science Foundation in China, 2020, 28(2), 85-103.41. Jikai Xu, Zhihao Ren, Bowei Dong, Xinmiao Liu, Chenxi Wang*, Yanhong Tian*, Chengkuo Lee*, Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy, ACS Nano, 2020, 14, 9, 12159–12172.42. Jikai Xu, Chenxi Wang*, Xiaoliang Ji, Qi an, Yanhong Tian*, Tadatomo Suga, Direct bonding of high dielectric oxides for high-performance transistor applications, Scripta Materiala, 2020, 178, 307-312.43. Jiayun Feng , Ming Xiao, Zhuang Hui, Daozhi Shen, Yanhong Tian*, Chunjin Hang, Walter W. Duley, and Norman Y. Zhou*, High-Performance Magnesium–Carbon Nanofiber Hygroelectric Generator Based on Interface-Mediation-Enhanced Capacitive Discharging Effect, ACS Applied Materials & Interfaces, 2020, 12, 21, 24289–24297.44. He Zhang, Yanhong Tian*, Shang Wang, Yilong Huang, Jiayue Wen, Chunjin Hang, Zhen Zheng, Chenxi Wang, Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device, Chemical Engineering Journal, 2020, 399(20),125075.45. He Zhang, Shang Wang, Yanhong Tian* , Yubin Liu, Jiayue Wen, Yilong Huang, Chunjin Hang, Zhen Zheng, Chenxi Wang, Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films, Chemical Engineering Journal, 2020, 399(6),124495.46. 马竟轩, 王尚，杨东升，田艳红*. 纳米银焊膏热烧结及通电热老化过程动态电阻监测研究. 机械工程学报，2020, 56(08).47. Dan Li, Yunhui Mei*, Yanhong Tian, Yunchang Xin.Doping low-cost SiOx (1.2 - x - 1.6) nanoparticles inhibit electrochemical migration of sintered silver at high temperatures, Journal of Alloys and Compounds, 2020, 830,154587.48. Wei Liu, Kai Zhu, Chunqing Wang*, Zhen Zheng*, Rong An, Wei Zhang, Minxi Zhu, Zhicheng Wen, Xinming Wang, Yubin Liu, Yanhong Tian. Laser induced forward transfer of brittle Cu3Sn thin film, Journal of Manufacturing Processes, 2020, 60, 48-53.49. Qiushi Kang, Chenxi Wang*, Fanfan Niu, Shicheng Zhou, Xiaoyun Qi, Jikai Xu, Yanhong Tian. Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding, Ceramics International, 2020,46,14, 22718-22726.50. Chenxi Wang*, Hui Fang, Shicheng Zhou, Xiaoyun Qi, Fanfan Niu, Wei Zhang, Yanhong Tian, Tadatomo Suga. Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices, Journal of Materials Science & Technology, 2020,46,156-167.51. Hui Fang, Chenxi Wang*, Shicheng Zhou, Ge Li, Yanhong Tian, Tadatomo Suga. Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg-Zn-Ca alloy, Journal of Magnesium and Alloys ,2020.52. Hui Fang, Chenxi Wang*, Shicheng Zhou, Qiushi Kang, Te Wang, Dongsheng Yang, Yanhong Tian, Tadatomo Suga. Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste, Journal of Materials Science: Materials in Electronics ,2020,31,8.53. Hui Fang, Chenxi Wang*, Shicheng Zhou, Zhen Zheng, Tian Lu, Ge Li, Yanhong Tian, Tadatomo Suga. Enhanced adhesion and anticorrosion of silk fibroin coated biodegradable Mg-Zn-Ca alloy via a two-step plasma activation, Corrosion Science,2020,168, 108466.54. Jikai Xu, Yu Du, Yanhong Tian, Chenxi Wang*. Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics, International Journal of Optomechatronics, 2020,14(1):94-118.55. He Zhang, Shang Wang, Yanhong Tian*, Jiayue wen, Chunjin Hang*, Zhen Zheng, Yilong Huang, Su Ding, Chenxi Wang. High efficiency extraction synthesis for high-purity copper nanaowires and their applications in flexible transparent electrodes. Nano Materials Science. 2020,2, 164-171.56. Hui Fang, Chenxi Wang*, Te Wang, Hong Wang, Shicheng Zhou, Yilong Huang, Yanhong Tian, Tadatomo Suga. Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging, Materials Letters, 2019, 256,120620.57. Yilong Huang, Yanhong Tian*, Chunjin Hang, Yubin Liu, Shang Wang, Miaomiao Qi, He Zhang, Jie Zhao*.Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters [J]. ACS Applied Materials & Interfaces, 2019, 11 (24): 21850-21858.58. Jiayue Wen, Yanhong Tian*, Changxiang Hao, Shang Wang, Zhipeng Mei, Weizhen Wu, Junyi Lu, Zhen Zheng, Yanqing Tian*. Fabrication of high performance printed flexible conductors by doping of polyaniline nanomaterials into silver paste. Journal of Materials Chemistry C, 2019,7: 1188.59. Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, Yilong Huang, Chao Liao. Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters, Composites Science and Technology, 2019, 174: 76-83.60. Yilong Huang, Yanhong Tian*, Chunjin Hang, Yubin Liu, Shang Wang, Miaomiao Qi, He Zhang, Qiqi Peng.TiO2-coated core-shell Ag nanowire networks for robust and washable flexible transparent electrodes, ACS Applied Nano Materials, 2019, 2, 2456-2466.61. Ruyu Tian, Chunjin Hang*, Yanhong Tian*,Yubin Liu,Bingying Wu, Jie Zhao. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures, Journal of Alloys and Compounds, 2019, 800: 180-190.62. Jiayue Wen,Yanhong Tian*, Chunjin Hang, Zhen Zheng, He Zhang, Zhipeng Mei, Xuanyi Hu, Yanqing Tian*. Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles. Nanomaterials, 2019,9: 960.63. Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, He Zhang, Yuan Huang, Zhen Zheng. One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors, ACS Omega, 2019, 4: 6092-6096.64. Jiayun Feng, Di Erick Xu, Yanhong Tian*, Michal Mayer*. SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9: 1623-1631.65. Su Ding, Yanhong Tian*.Recent progress of solution-processed Cu nanowires transparent electrodes and their applications. RSC Advance.2019,9(46):26961-26980.66. Jikai Xu, Chenxi Wang*, Runbo Zhang, Ji Cheng, Ge Li, Junshan Xiang, Yanhong Tian*, VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices.Applied Surface Science. 2019, 495, 143576.67. Ruyu Tian, Chunjin Hang, Yanhong Tian*, Jikai Xu. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes, Journal of Materials Processing Techonology, 2019, 268: 1–9.68. Ruyu Tian, Chunjin Hang, Yanhong Tian*,Jiayun Feng. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment, Journal of Alloys and Compounds, 2019, 777: 463-471.69. Jikai Xu, Chenxi Wang*, Shicheng Zhou, Runbo Zhang, Yanhong Tian*,Low-temperature direct bonding of Si and quartz glass using the APTES modification. Ceramics International. 2019, 45, 16670-16675.70. Jikai Xu,Chenxi Wang*, Daoyuan Li, Ji Cheng, Yiping Wang, Chunjin Hang, Yanhong Tian, Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature Ceramics International. 2019, 45, 4094-4098.71. Ge Cao, Xiaolan Gao, Linlin Wang, Huahua Cui, Junyi Lu, Yuan Meng, Wei Xue, Chun Cheng, Yanhong Tian*, Yanqing Tian*.Easily Synthesized Polyaniline@Cellulose Nanowhiskers Better Tune Network Structures in Ag-Based Adhesives: Examining the Improvements in Conductivity, Stability, and Flexibility. Nanomaterials, 2019, 9, 1542.72. Wei Liu, Yiping Wang, Zhen Zheng*, Rong An, Yanhong Tian, Lingchao Kong, Ronglin Xu，Chunqing Wang*. Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles, 2019, 30, 7787-7793.73. 李跃, 田艳红*, 丛森，张伟玮. PCB组装板多器件焊点疲劳寿命跨尺度有限元计算.机械工程学报，2019, 6, 54-60.74. 黄圆, 杭春进,田艳红*, 王晨曦, 张贺.纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究.机械工程学报, 201975. 黄圆，田艳红*，江智， 王晨曦. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究.机械工程学报, 201776. Yilong Huang, Yayun Liu, Kareem Youssef, Kwing Tong, Yanhong Tian*, Qibing Pei*. A solution processed flexible nanocomposite substrate with efficient light extraction via periodic wrinkles for white organic light-emitting diodes, Advanced Optical Materials, 2018: 180101577. Jiayun Feng, Chunjin Hang, Yanhong Tian*, Chenxi Wang, Baolei Liu, Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints, Journal of Alloys and Compounds, 2018, 753: 203-21178. Shang Wang, Yanhong Tian*, Chenxi Wang*, Chunjin Hang, Communication—Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes, Journal of the Electrochemical Society, 2018, 165(9): D328-D33079. Shang Wang, Yanhong Tian*, Chunjin Hang, Chenxi Wang. Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining, Scientific Reports, 2018(8):526080. Jiayun Feng, Chunjin Hang, Yanhong Tian*, Baoleiliu, Chenxi Wang, Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current, Scientific Reports, 2018(8):177581. Su Ding; Yanhong Tian*; Jinting Jiu; Katsuaki Suganuma. Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates. RSC Adv. v 8, p 2109-2115, 201882. Ruyu Tian; Chunjin Hang; Yanhong Tian*; Liyou Zhao. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Materials Science ＆ Engineering A,V709, 2018, P 125-13383. Chenxi Wang*,Daoyuan Li, Shang Wang, Boyan Huang, and YanhongTian, A Self-Contained Temperature Sensing Approach for Ultrafast Microwelding,Journal of the Electrochemical Society, Vol. 165, No. 5, 2018, pp. B220-B22284. Chenxi Wang*, Jikai Xu, Shu Guo, Qiushi Kang, Yuan Wang, Yiping Wang, Yanhong Tian, A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation. Applied Surface Science. 2018, 471, 196-204.85. Jikai Xu, Chenxi Wang*, Yanhong Tian*, Bin Wu, Shang Wang, He Zhang, Glass-on-LiNbO 3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method.Applied Surface Science. 2018, 459, 621-629.86. Jikai Xu, Chenxi Wang*, Te Wang, Yuan Wang, Qiushi Kang, Yannan Liu, Yanhong Tian, Mechanisms for Low-Temperature Direct Bonding of Si/Si and Quartz/Quartz via VUV/O3 Activation, RSC Advances, Vol. 8, 2018,pp. 11528-11535.87. Chenxi Wang, Jikai Xu, Xiaoyun Qi, Yannan Liu, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air, Journal of The Electrochemical Society, Vol. 165, No. 4, 2018, pp. H3093-H3098.88. Chenxi Wang, Jikai Xu, Xiaorun Zeng, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Low-Temperature Wafer Direct Bonding of Silicon and Quartz Glass by a Two-Step Wet Chemical Surface Cleaning, Japanese Journal of Applied Physics, Vol. 57, 02BD02, 2018.89. Chunjin Hang, Ruyu Tian, Liyou Zhao, Yanhong Tian*, Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock, Applied Sciences, 2018, 8(11), 2056.90. Chunjin Hang, He Zhang, Yanhong Tian*, Chenxi Wang, Yuan Huang, Zhen Zheng, Chunqing Wang, A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package, Applied Sciences, 2018, 8(11), 2188.91. Wei Liu, Rong An*, Chunqing Wang, Zhen Zheng, Yanhong Tian, Ronglin Xu, Zhongtao Wang, Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications, Micromachinces, 2018, 9, 346.92. 王晨曦*, 王源，田艳红，王春青. 基于广义铺展条件下的倒装焊焊点形态预测. 焊接学报, Vol. 39, No. 2, 2018, pp. 1-4%2B14.93. 刘威，费义鹍，郑振，安荣，张威，王春青，田艳红，朱泯西. 激光前向转移技术及其温度场数值模拟研究. 精密成形工程, Vol. 10, No. 01, 2018.94. 王晨曦, 王特，许继开，王源，田艳红. 晶圆直接键合及室温键合技术研究进展. 焊接学报, 精密成形工程, Vol. 10, No. 01, 2018.95. Chenxi Wang*, Yuan Wang, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Room-temperature direct bonding of silicon and quartz glass wafers. Applied Physics Letters, 2017,110: 221602- 1~496. Wei Liu, Chunqing Wang, Guangbin Dou#, Yanhong Tian, Lei Yang*. Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface. Applied Physics Express97. Chenxi Wang, Yannan Liu*, Yue Li*, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Mechanisms for room-temperature fluorine containing plasma activated bonding. ECS Journal of Solid State Science and Technology, 2017,6(7): 373-37898. Chenxi Wang, Yue Li*, Yannan Liu*, Zhitian Yuan*, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Investigation of thermal treatment processes for dissimilar wafer bonding. ECS Transactions, 2017, 77(5): 143-15299. Ruyu Tian, Yanhong Tian*, Chenxi Wang, Liyou Zhao. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures. Materials Science ＆ Engineering A, v 684, p 697-705, 2017100. Baolei Liu; Yanhong Tian*; Jiang Feng; Chenxi Wang. Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process. J Mater Sci, v 52, p 1943-1954, 2017101. Baolei Liu; Yanhong Tian*; An Rong; Chunqing Wang. Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current. Intermetallics, v 80, p 26-32, 2017102. Jiayue Wen; Yanhong Tian*; Zhipeng Mei; Weizhen Wu; Yanqing Tian. Synthesis of polypyrrole nanoparticles and their applications in electrically conductive adhesives for improving conductivity. RSC Adv., v 7, p 53219, 2017103. Chenxi Wang, Yuan Wang, Yanhong Tian, Chunqing Wang, andTadatomo Suga, “Room-Temperature Direct Bonding of Silicon and Quartz Glass Wafers”, Applied Physics Letters, Vol. 110, 221602, 2017.104. Chenxi Wang, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 7, 2017, pp. P373-P378.105. 王尚; 田艳红*. 微纳连接技术研究进展. 材料科学与工艺, 2017，25（5):1-5106. 田茹玉, 王晨曦, 田艳红*, 赵利有. 极限温度下 CBGA 焊点热冲击疲劳寿命预测. 焊接学报, 2017, 38(10): 93-97.107. 黄圆; 田艳红*; 江智; 王晨曦. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究. 机械工程学报, v 53(4),:34-42 2017108. Yilong Huang*; Ziyang Xiu#; Gaohui Wu; Yanhong Tian; Peng He. Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets. Journal of Materials Science: materials in Electronics, 27: 6809- 6815, 2016109. Yilong Huang, Ziyang Xiu, Gaohui Wu, Yanhong Tian, Peng He, Xiaolong Gu, Weimin Long. Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets. Materials Letters, 169:262-264, 2016110. 王晨曦, 安荣, 田艳红，王春青. 镀银的铜引线与PCB焊盘平行微隙焊时的界面行为. 焊接学报, Vol. 37, No. 11, 2016, pp. 55-58.111. Shang Wang, Yanhong Tian*, Chunqing Wang. The role of chloride ions in rapid synthesis of ultra-long silver nanowires for flexible electrodes 2016112. Shang Wang, Yanhong Tian*, Su Ding, Yilong Huang. Rapid synthesis of long silver nanowires by controlling concentration of Cu2%2B ions. Materials Letters, v 172, p 175-178, 2016113. 江智, 田艳红; 丁苏. Sn3.5Ag0.5Cu 纳米颗粒钎料制备及钎焊机理. 金属学报, v 52, n 1, p 105-112, 2016114. Baolei Liu, Yanhong Tian*,Wei Liu, Weiwei Wu, Chunqing Wang. TEM observation of interfacial compounds of Sn Ag Cu/ENIG solder bump after laser soldering and subsequent hot air reflows. Materials Letters, v 163, p 254-257, 2016115. Baolei Liu, Yanhong Tian*, Jingkai Qin, Rong An. Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress. J Mater Sci: Mater Electron, v 27, p 11583-11592, 2016116. Baolei Liu, Yanhong Tian*, Chenxi Wang, Rong An, Yang Liu. Extremely fast formation of Cue Sn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process. Journal of Alloys and Compounds, v 687, p 667-673, 2016117. Yanhong Tian*, Zhi Jiang, Chenxi Wang, Su Ding. Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air. RSC Adv. v 6, p 91783-91790, 2016118. Zhi Jiang,Yanhong Tian*,Su Ding,Jiayue Wen,Chenxi Wang. Facile synthesis of Cu–Ag hybrid nanowires with strong surface-enhanced Raman scattering sensitivity. CrystEngComm, v 18, p 1200-1206,2016119. Su Ding,Jinting Jiu,Yue Gao,Yanhong, Tian*,Teppei Araki. One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices. 2016, ACS Appl. Mater. Interfaces120. Haihong Li*, Rong An, Chunqing Wang, Yanhong Tian, Zhi Jiang.Effect of Cu grain size onthe voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters, 144: 97-99,2015121. Wei Liu, Rong An, ChunqingWang, Yanhong Tian. Effect of Au-Sn IMCs’formation and morphologies on shear properties of laser reflowed micro-solderjoints. Soldering & Surface Mount Technology, 27(1): 45-51,2015122. Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu,Rong An. Fracture Statistics Dominated by Hot-Cutting Defect and Deviation from Weibull Distribution. Journal of Harbin Institute of Technology (New Series), 22(2): 41-48, 2015123. Su, Ding, Jinting, Jiu*, Yanhong Tian*, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma. Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air. Physical Chemistry Chemical Physics, v 17, p 31110-31116, 2015124. Su, Ding, Yanhong, Tian*, Zhi, Jiang, Xiaobin, He. Molecular dynamics simulation of joining process of Ag-Au nanowires and mechanical properties of the hybrid nanojoint. AIP Advances, v ,5, 057120, 2015125. Su Ding, Yanhong Tian*, Zhi Jiang, Chunqing Wang. Joining of silver nanowires by femtosecond laser methods. Materials Transactions, v 56, p 981-983, 2015126. Ying, Ding, Ruyu Tian, Xiuli Wang, Chunjin Hang, Fang Yu, Ling Zhou, Xiangang Meng, Yanhong Tian*. Coupling Effects of Mechanical Vibrations and Thermal Cycling on Reliability of CCGA Solder Joints. Microelectronics Reliability, v 55, n 11, p 2396-2402, 2015127. Rong An, Yanhong Tian, Rui Zhang, Chunqing Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics, v 26, p 2674-2681, 2015128. Yanhong Tian*; Chunjin Hang, Xin Zhao, Baolei Liu, Ning Wang, Chunqing, Wang. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding. Journal of Materials Science: Materials in Electronics, v 25, p 4170-4178, 2014129. Zhi, Jiang; Yanhong, Tian*; Su, Ding. Synthesis andcharacterization of ultra-long and pencil-like copper nanowires with a penta-twinned structure by hydrothermal method. Materials Letters, v 136, p 310-313, 2014130. Yanhong, Tian*; Rui, Zhang; Chunjin, Hang; Lina, Niu; Chunqing, Wang. Relationship between morphologies and orientatios of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Materials Characterizaton, v 88, p 58-68, 2014131. Rui, Zhang; Yanhong, Tian*; Chunjin, Hang; Baolei, Liu; Chunqing Wang. Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. Materials Letters, v 110, p 137-140, 2013132. Chunjin, Hang; Yanhong, Tian*; Rui Zhang; Dongsheng Yang. Phase transformation and grain orientation of Cu-Sn intemetallic compounds during low temperature bonding process. Journals of Materials Science: Materials in Electronics, v 24, n 10, p 3905-3913, 2013133. Wei Liu; Yanhong Tian; Chunqing Wang; Lining Sun. Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow process. Journal of Materials Science: Materials in Electronics, v 24, p 217-223, 2013134. Yang, Lei; Liu, Wei; Wang, Chunqing; Tian, Yanhong. Surface-Tension-Driven Self-Assembly of 3-D Microcompounds by Using Laser Reflow Soldering and Wire Limiting Mechanisms. IEEE Transactions on Components Packaging and Manufacturing Technology, v 3, n 1, p 168-176, 2013135. 田艳红*，贺晓斌，杭春进. 残余应力对混合组装BGA热循环可靠性影响，机械工程学报 2013136. 杭春进，田艳红*，赵鑫，王春青. 混装BGA器件高温老化实验焊点微观组织研究，金属学报 v 7, n 49, p 831-837, 2013137. 杭春进，田艳红*，王春青. 细径铜丝超声键合焊点高温存储可靠性分析，焊接学报 v 2, n 34, p 13-16, 2013138. 刘威，窦广彬，王春青，田艳红，叶交托. 激光诱发前向转移技术在电子制造领域的应用，电子工艺技术 v 2, n 34, p 70-72, 2013139. Tian, Yanhong*; Liu,Wei; An, Rong; Zhang, Wei; Niu, Lina; Wang, Chunqing. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test. Journal of Materials Science: Materials in Electronics, v 23, n 1, p 136-147, 2012140. Liu,Wei; Tian, Yanhong*; Wang, Chunqing; Wang, Xuelin; Liu, Ruiyang.Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints. Materials Letters, v 86, p 157-160, 2012141. Chunjin Hang; Yanhong Tian*; Chunqing Wang; Ning Wang. Ultrasonic Bondability and Antioxidation Property of Ti/Cu/TaN/Ag Multi-layers on Si Substrate. Thin Solid Films, v 524, p 224-228, 2012142. Liu,Wei; Tian, Yanhong; Yang, Lei; Wang, Chunqing; Sun, Lining.Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air atmosphere. Soldering and Surface Mount Technology, v 24, n 3, p 191-196, 2012143. 田艳红*,王宁,杨东升,王春青. 三维封装芯片键合IMC焊点应力分析及结构优化,焊接学报,2012,33(8):1-3.144. Yanhong Tian*, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin.Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Materials Science and Engineering A 529 (2011) 468– 478145. Yanhong Tian*, C J Hang, C Q Wang,G. Q Ouyang, J P Zhao. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound Microelectronics Reliability, 2011(1):157-165146. 田艳红*； 杨东升； 王春青 细Cu丝超声球焊烧球工艺参数优化及Cu球组织分析. 焊接学报 2011,31(1): pp 1-4147. 王春青，王学林，田艳红，SnAgCu无铅微焊点剪切力学性能的体积效应，焊接学报，第32卷 第4期，2011年4月p1-4148. 田艳红*，王春青，赵少伟. Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能.金属学报2010,5(46):618-622149. 田艳红*，王春青，杨世华. Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应. 金属学报. 2010,3(46):366-371150. Shihua Yang, Yanhong Tian*, Chunqing Wang, Investigation on Sn grain number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes. Journal of Materials Science-Materials in Electronics 2010(21):1174-1180151. Dewen Tian, Yanhong Tian*, Chunqing Wang.Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface, Journal of Materials Science 2009,44(7), pp 1772-1779152. Dewen Tian, Chunqing Wang, Yanhong Tian. Modeling of Micropitch Shift of a Magnetoelectrical Sensor During Laser Solder Ball Bonding Process. IEEE Transactions on Advanced Packaging 2009,32(1)::p136-145153. 黄腾飞，杨世华，牛丽娜，田艳红，王春青，含有限晶粒的微小接头的拉伸变形行为研究，电子工艺技术，2009年第6期154. 刘琪 ，李卫 ，田艳红 气孔缺陷对同轴电缆焊点热疲劳寿命影响，电子工艺技术，2009年9月155. Yanhong Tian*, Chunqing Wang, J.P.Jung, Ivan Lum, N.Zhou. Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. Journal of materials processing technology, 2008,208(1-3) 179-186156. Yanhong Tian*, Chunqing Wang, Y.Zhou. Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations. Journal of materials processing technology 2008(199):p41-48157. Yanhong Tian*, Chunqing Wang, Yarong Chen. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls. J. Mater. Sci. Technol. 2008,24(2) :p220-226158. Yanhong Tian*, Chunqing Wang. Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate. Transactions of Nonferrous Metals Society of China 2008,18(2): 132-137159. Dewen Tian, Yanhong Tian*, Chunqing Wang and Chunjin Hang. Three-dimensional modelling of solder droplet impact onto a groove. JOURNAL OF PHYSICS D: APPLIED PHYSICS. 41 (2008) 245503 (12pp)160. Ying Ding, Chunqing Wang, Yanhong Tian. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in In-situ tensile test. Journal of Alloys and Compounds 2008 31(1) 274-285161. Chunjin Hang, Chunqing Wang, Yanhong Tian. Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectronics Reliability 48 (2008):p416–424162. Wei Liu, Chunqing Wang, Yanhong Tian. Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process. Journal of Alloys and Compounds 2008, 458(1-2):323-329163. Chunjin Hang, Chunqing Wang, Yanhong Tian. Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering 2008(85): 1815-1819164. Rong An, Chunqing Wang, Yanhong Tian. Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations Journal of ELECTRONIC MATERIALS Vol.37,No.7,2008165. Rong An, Chunqing Wang, Yanhong Tian Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations. Journal of ELECTRONIC MATERIALS Vol. 37, No. 4, 2008: 477- 482166. Wei Zhang, Chunqing Wang, Yanhong Tian Numerical and experimental analysis of solder joint self-alignment in fiber attachment soldering Journal of Electronic Packaging, Transactions of the ASME 2008(130):91-99167. Fuqian Li, Chunqing Wang, Yanhong Tian. Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad. Materials Science and Technology 2008 （24）: 6168. Dewen Tian, Chunqing Wang, Yanhong Tian. Effect of solidification on solder bump formation in solder jet process: Simulation and experiment. Trans. Nonferrous Met. Soc. China.18(2008) 1201-1208169. W Liu, C Q Wang, Y H Tian, Y R Chen. Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils. Trans. Nonferrous Met. Soc. China. 18(2008) 617-622170. 田德文，田艳红，王春青，孔令超均匀钎料熔滴喷射装置设计，机械工程学报，2008年12期171. 田德文，田艳红，王春青。 面向MEMS封装的微钎料球键合技术，电子工业专用设备，2008年37卷5期172. 韩磊磊，王春青，田艳红，一种白光LED投射灯组装结构的热分析，电子工艺技术，2008年第5期173. 鲁凯，王春青，田艳红，Cu引线超声键合FAB工艺及影响研究，电子工艺技术，2008年第4期174. 曾超，王春青 田艳红，孔令超，热切缺陷对氧化铝陶瓷强度的影响，宇航材料与工艺，2008年第2期175. 杭春进，王春青，田艳红，张丞，塑料封装铜丝内连电子元器件开封新工艺研究，电子工艺技术，2008年1期176. TIAN Yanhong, WANG Chunqing, and :Liu Wei. Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process. RARE METALS Vol.26,S pecI.s sueA, ug2007p, .331- 337177. Ding, Ying; Wang, Chunqing; Tian, Yanhong; Li, Mingyu. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests. Journal of Alloys and Compounds, v 428, n 1-2, Jan 31, 2007, p 274-285178. H.T. Chen, C.Q. Wang, Cheng.Y, and Y. Huang, Y.H. Tian. Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of electronic materials , Vol.36 No.1(2007) 26-32179. Yanhong Tian, Chunqing WANG and Danyang ZHU. Shape Prediction and Reliability Design of Ball Grid Array Solder Joints. Key Engineering Materials Vols. 353-358 (2007)180. Yanhong Tian and Chunqing WANG. Modeling of the Temperature Field during Electron Beam Welding of Aluminum Alloy by a Pre-defined Keyhole. Key Engineering Materials Vols. 353-358 (2007)181. Hang Chunjin, Wang Chunqing and Tian Yanhong. Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds, China Welding. Vol.16 No.3 Sep. 2007:46-50182. 刁慧，王春青，赵振清，田艳红，孔令超. SnCu钎料镀层与Cu/Ni镀层钎焊接头的界面反应. 中国有色金属学报. Vol.17 No.3 2007:410-416183. 田艳红，王春青，孔令超. 激光键合技术在封装中的应用及研究进展. 电子工业专用设备. May. 2007（总第148 期）184. Ying Ding, Chunqing Wang, Yanhong Tian, and Binbin Zhang. In-situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy.Metallurgical and Materials Transactions A. Vol. 37A, March, 2006, pp. 1017-1025185. 王春青，田艳红，孔令超。电子封装与组装无铅化应用中的问题，半导体行业，2006年12月第75期:46-51186. Hongtao CHEN, Chunqing WANG, Mingyu LI, Yanhong TIAN, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Engineering, 2005 Vol.21 No.3 P.419-422187. 李福泉，王春青，田艳红，孔令超，钎料熔滴与焊盘界面反应及再重熔时的界面组织演变，中国有色金属学报，第15卷第10期：1506-1511，2005年188. 周文凡，田艳红，王春青，BGA焊点的形态预测与可靠性优化设计，电子工艺技术，26卷第4期，2005年7月:p187-191189. Yanhong Tian, Chunqing Wang, Deming Liu. Thermomechanical Bechavior of PBGA Package during Laser and Hot Air Reflow Soldering. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2004, (12): 235 – 243190. 李福泉，王春青，田德文，田艳红，SnPb 钎料熔滴与 Au/Ni/Cu 焊盘的反应过程，中国有色金属学报，2004年7月，14卷第7期 :p1139-1143191. 王春青，李明雨，田艳红，JIS Z 3198 无铅钎料试验方法简介与评述，电子工艺技术，2004 年第 2 期 :pp47-54192. Yanhong Tian, Chunqing Wang, Xiaodong Zhang and Deming Liu, Interaction Kinetics between PBGA Solder Balls and Au/Ni/Cu Metallisation during Laser Reflow Bumping, Soldering & Surface Mount Technology, Vol.15 No.2, 2003:pp17-21(Awarded by Emerald Literati Club, 2004 Highly Commended Award)193. 丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测 -I. 焊点抗热疲劳能力的实验研究，金属学报，第39卷，第8期，2003年:879-884194. 丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测 -II. 焊点内部力学响应特征的数值模拟，金属学报，第39卷，第8期，2003年 :885-891195. Tian, Yanhong; Wang, Chunqing; Ge, Xiushan; Liu, Peter; Liu, Deming, Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes,Materials Science and Engineering: B Volume: 95, Issue: 3 Sep. 1, 2002 pp. 254-262196. 田艳红，王春青，激光重熔 PBGA 钎料球与 Au/Ni/Cu 焊盘界面反应，金属学报，2002;38(1):95-98197. 田艳红，王春青. 激光与红外重熔对 63Sn37Pb/ 焊盘界面微观组织的影响，中国有色金属学报，2002 年，第 12 卷第 3 期 :471-475198. 田艳红，王春青，微电子封装与组装中的再流焊技术研究进展，焊接，2002 年第 6 期： 5-9199. 田艳红，王春青，张哓东，激光加热条件下 SnPb 共晶钎料与 Au/Ni/Cu 焊盘界面反应动力学，材料科学与工艺，Vol.10 No.2, Jun. 2002:pp136-139200. 田艳红，王春青. 激光重熔在钎料凸点成形中的应用，电子工艺技术，2002 年，第 23 卷第 4 期： 139-142201. 田艳红，王春青，钎料球激光重熔温度场数值模拟，焊接学报，2001 年第 2 期： P75-78. 会议论文 名称 1. He Zhang, Fangyuan Sun, Jiayun Feng, Shang Wang, Xuanyi Hu, Fengyu Su, Yanqing Tian, Yanjun Liu, Yanhong Tian*, "Silver nanowire-based current collector for bifunctional flexible electrochromic supercapacitors," 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).2. Geng Li, Jiayun Feng, Taohan Wang, Zicheng Sa, Yanhong Tian*, "Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling," 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).3. Shuai Wang, Jiayun Feng, Zicheng Sa,Yiping Wang, Shang Wang, Yanhong Tian*, "Interfacial reaction of Cu/SnPbInBiSb/Cu sandwich solder joints," 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).4. Shang Wang, Xuanyi Hu, Yan Feng, Jingxuan Ma, Songzhuo Ren, Yanhong Tian*, "Silver ions assisted nanosoldering electrohydrodynamic (EHD) printing of RFID antennas," 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).5. Ruyu Tian, Chunlei Wang, Yanhong Tian*, "Shear Properties and Fracture Behaviors of Cu/Sn-37Pb/Cu Solder Interconnections at Cryogenic Temperatures," 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).6. Qiushi Kang, Chenxi Wang*, Ge Li, Shicheng Zhou, Yanhong Tian, "Low-temperature Cu/SiO2 hybrid bonding using a novel two-step cooperative surface activation," 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).7. Zicheng Sa, Shang Wang, Jiayun Feng, Guangliang Yu, Ning Zhang, Yanhong Tian*, "A quick correction method for the board-level finite element analysis of QFP device under vibration," 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).8. Jikai Xu, Zhihao Ren, Xinmiao Liu, Cheng Xu, Chenxi Wang, Yanhong Tian, Chengkuo Lee*, "Heterogeneous LiNbO3/Si Direct Bonding for Wavelength-Dependent Mid-Infrared Imaging," 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Orlando, FL, USA, 2021.9. 王尚，撒子成，田艳红*.微波组件平行封焊过程有限元仿真及工艺优化. 2020, 第二十四次全国焊接学术会议“计算机辅助焊接工程”分会场摘要集.10. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Tian Lu, Yanhong Tian. Low-temperature bonding and interfacial failure behavior of Si/glass and glass/glass chips, 2020 21th International Conference on Electronic Packaging Technology (ICEPT).11. Jingxuan Ma, Jiayun Feng, Yanhong Tian*, Di eric Xu, Michael Mayer.Dynamic resistance monitoring of aging process of pressureless sintered nano-silver joints, 2019 20th International Conference on Electronic Packaging Technology (ICEPT).12. Te Wang, Chenxi Wang, Hui Fang, Qiushi Kang, Rong An, Yanhong Tian. Pressureless Low-Temperature Sintering of Silver Nano-Solder Paste Based on Surface Activation, 2019 20th International Conference on Electronic Packaging Technology (ICEPT).13. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, JiKai Xu, Rong An, Yanhong Tian. Fabrication of SiC-on-insulator substrate via a low-temperature plasma activated bonding process, 2019 20th International Conference on Electronic Packaging Technology (ICEPT).14. JiKai Xu, Chenxi Wang*, Qiushi Kang, Shichen Zhou, Yanhong Tian*.Direct Heterogeneous Bonding of SiC to Si, SiO2, and Glass for High-performance Power Electronics and Bio-MEMS, 2019 69th Electronic Components and Technology Conference (ECTC)15. Shang Wang, Yanhong Tian*. Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters, 2018 68th Electronic Components and Technology Conference (ECTC).16. Bingying Wu, Chunjin Hang, Yue Li, Yang Liu, Yanhong Tian*, Weiwei Zhang,Thermo-mechanical Modelling of Cu Wire Parallel Gap Micro-resistance Welding Process, 2018 19th International Conference on Electronic Packaging Technology (ICEPT)17. Xiaoyun Qi, Chenxi Wang*, Qiushi Kang, Daoyuan Li, Yanhong Tian, Lingchao Kong, Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding Method, 2018 19th International Conference on Electronic Packaging Technology (ICEPT)18. Jikai Xu, Chenxi Wang*, Xiaoyun Qi, Bin Wu, Shicheng Zhou, Yanhong Tian*,VUV/O3 activated bonder for low-temperature direct bonding of Si-based materials,2018 19th International Conference on Electronic Packaging Technology (ICEPT)19. Yue Zhang, Chenxi Wang*, Zhitian Yuan, Yanhong Tian, Guoliang Fan*, Jason Guo, Investigation of Moisture Diffusion in Plastic Electronic Packages by Molecular Dynamics Simulation, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)20. Yue Li, Chenxi Wang*, Yuan Wang, Xiaoyun Qi, Yanhong Tian, Investigation of Bonding Front Propagation for Wafer Direct Bonding, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)21. Jikai Xu, Chenxi Wang*, Xiaoyun Qi, Yongheng Jia, Xiapliang Ji, Yanhong Tian, Chunqing Wang. A novel method for bonding strength evaluation,2017 18th International Conference on Electronic Packaging Technology (ICEPT)22. Chongyang Cai, Rong An*, Chunqing Wang, Yanhong Tian, Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)23. Wei Liu*, Yiping Wang, Chunqing Wang, Yanhong Tian, Copper-tin reaction and preparation of microsolder joints under high frequency alternating magnetic field, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)24. Wei Liu*, Yuzhuo Nie,Chunqing Wang, Yanhong Tian,Effect of multilayer films and current on IMC formation in solder joints,2017 18th International Conference on Electronic Packaging Technology (ICEPT)25. Wei Liu*, Ronglin Xu, Chunqing Wang, Yanhong Tian, Study on preparation and rapid laser sintering process of nano silver pastes,2017 18th International Conference on Electronic Packaging Technology (ICEPT)26. Yuan Huang, Chunjin Hang, Yanhong Tian*, He Zhang, Xiuli Wang. Rapid Sintering of Copper Nanopaste by Pulse Current for Power Electronics Packaging, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)27. Yue Li, Chunjin Hang, Yanhong Tian*, Chunqing Wang. Interposer Connection Reliability using Double-Side Solder Bump for Board-Level Vertical Interconnection, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)28. Yongheng Jia, Yanhong Tian*, Chunjin Hang, Wei Liu, Chunqing Wang. Reliability prediction of different size solder bumps in thermal shock test using FEM, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)29. Ruyu Tian, Chunjin Hang, Yanhong Tian*, Liyou Zhao. Microstructure evolution and mechanical property of Sn-37Pb and Sn-3.0Ag-0.5Cu BGA solder joints under extreme temperature environment, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)30. YunSong Dong, Ying Ding, Yanhong Tian*, Bo Xiao. A significant blocking effect of Ni plating layer on the diffusion of Zn element of brass substrate, 2017 18th International Conference on Electronic Packaging Technology (ICEPT)31. Yilong Huang, Ziyang Xiu,Yanhong Tian*. Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer-graphene. Semiconductor Technology International Conference (CSTIC), 2016 China32. Su Ding, Yanhong Tian*, Jinting Jiu, Katsuaki Suganuma. Fabrication of copper nanowire/polydime thylsiloxane stretchable conductors by a high intensity pulsed light method. Semiconductor Technology International Conference (CSTIC), 2016 China33. Shang Wang, Yanhong Tian*, Jie Yu. Synthesis of ultra-long silver nanowires and the joining of silver networks. Semiconductor Technology International Conference (CSTIC), 2016 China34. Yang Liu; Yanhong Tian*; Baolei Liu; Jiayun Feng. Interconnection of Cu wire/Au plating pads using parallel gap resistance microwelding process, 2016 17th International Conference on Electronic Packaging Technology (ICEPT)35. Ruyu Tian; Yanhong Tian*; Chenxi Wang. Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag 0.5Cu Solder Alloy, 2016 17th International Conference on Electronic Packaging Technology (ICEPT)36. Xiaoliang Ji, Rong An*, Chunqing Wang, Yanhong Tian, Microstructure of solar cell interconnections by resistance welding,2016 17th International Conference on Electronic Packaging Technology (ICEPT)37. Zhi Jiang, Yanhong Tian*, Yuan Huang, Jiayue Wen, Facile preparation of sintered Cu-Ag bimetallic nanoparticle paste with low porosity,2016 17th International Conference on Electronic Packaging Technology (ICEPT)38. Jiayue Wen; Yanhong Tian*. The Synthesis of Cu-Ag Core-Shell Bimetallic nanoparticles for IC bonding, 2016 17th International Conference on Electronic Packaging Technology, p: 788-79039. Jiayun Feng; Baolei Liu; Yanhong Tian. Influence of Electric Current on the Grain Orientation of Cu-Sn Intermetallic Compounds in Cu/Molten Sn/Cu Interconnection System, 2016 17th International Conference on Electronic Packaging Technology, p: 348-35140. Baolei, Liu; Yanhong, Tian; Yang, Liu; Chenxi, Wang. Rapid formation of full Cu-In intermetallic compounds (IMCs) joints under electric current, 2015 65th Electronic Components and Technology Conference, p: 1780-178441. Su, Ding; Yanhong, Tian; Zhi, Jiang; Chenxi, Wang. Joining of silver nanoparticles by femtosecond laser irradiation method, 2015 65th Electronic Components and Technology Conference, p: 1213-121842. Xuguang, Guo; Yanhong, Tian; Shang, Wang; Chunqing, Wang. Parallel Gap Resistance Thick Wire Bonding for Vertical Interconnection in 3D Assembly, 2014 15th International Conference on Electronic Packaging Technology, p: 6-943. Shang, Wang; Yanhong, Tian; Xunguang, Gu. Fatigue Life Prediction for CBGA under Random Vibration Loading by Finite Element Method, 2014 15th International Conference on Electronic Packaging Technology, p: 535-53744. Baolei, Liu; Yanhong, Tian; Shang, Wang; Rui, Zhang; Xin, Zhao; Chenglong, Dong; Chunqing, Wang.Rapid Formation of Cu-Sn Intermetallic Compounds by Strong Electric Current, 2014 15th International Conference on Electronic Packaging Technology, p: 489-49245. Xue, Du; Yanhong, Tian*; Xin, Zhao. Mechanical Properties and Microstructure of Sn-Based solder Joints at Cryogenic Temperature, 2014 15th International Conference on Electronic Packaging Technology, p: 888-89246. Yanhong, Tian*; Baolei, Liu; Rui, Zhang; jingkai Qin. Electromigration Failure of SnAgCu Lead-free BGA package Assembled with SnPb Solder Paste, 2013 14th International Conference on Electronic Packaging Technology, p: 892-89547. Rui, Zhang; Yanhong, Tian*; Baolei, Liu;Chunjin, Hang. Growth mechanism of Cu-Sn full IMC jonts on polycrystalline and single Cu substrate, 2013 14th International Conference on Electronic Packaging, p: 1276-127948. Xin, Zhao; Yanhong, Tian*; Ning, Wang. Shearing properties of low tempreture Cu-In Solid-Liquid intediffusion in 3D package, 14th Interntional Conference on Elctronic Pachaging Technology, p:143-14749. Yanhong Tian, Jingkai Qin, Xiaobin He, Chunqing Wang. Effect of Grain Orientation on Electromigration Degradation in Lead-free Solder Joints, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP),p:1080-108250. Yanhong Tian, Ning Wang, Yang Li, Chunqing Wang. Mechanism of Low Temperature Cu-In Solid-Liquid Interdiffusion Bonding in 3D Package, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP),p:216-21851. Jiandong Zhu, Chunqing Wang, Chunjin Hang, Yanhong Tian. Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP),p: 40-4352. Lei yang, Chunqing Wang, Wei Liu, Yanhong Tian. A Dynamic Model for Analyzing the Motion of Molten Solder During Self-Assembly, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP),p:649-65253. Qi Lin, Wang Chunqing, Tian Yanhong. Thermal Design of a LED Multi-chip Module for Automotive Headlights, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP),p: 1435-143838.54. Fuquan Li, Chunqing Wang and Yanhong Tian. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu pad, Journal of Materials Science and Technology, Vol.22, No.3, 2006:p392-39655. Yanhong Tian; Lina Niu; Chunqing Wang; , "Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on , vol., no., pp.1-4, 8-11 Aug.56. Zeng Chao; Wang Chunqing; Tian Yanhong; Liu Wei; An Rong; Hang Chunjing; , "Characterization of the hot-cutting defects produced by the processing of alumina green tape," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on , vol., no., pp.1-4, 8-11 Aug. 201157. Lei Yang; Wei Liu; Chunqing Wang; Yanhong Tian ; , "Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on , vol., no., pp.1-4, 8-11 Aug. 201158. Lei Yang; Wei Liu; Chunqing Wang; Yanhong Tian; , "Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on , vol., no., pp.1-4, 8-11 Aug. 201159. Yanhong Tian, Bo Long,Chunqing Wang,Finite Element Analysis of Electromigration Reliability in Copper Chip Interconnect,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p112460. Yanhong Tian, Ningning Wang, Chunqing Wang,Shaowei Zhao,Ultrasonic Bondability and Antioxidation Property of Ti/Cu/Ag Metallization on Si Substrate,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p30561. Wei Liu, Chunqing Wang, Lining Sun,Yanhong Tian ,Effect of Protection Atmosphere’s Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-solder Joints,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p44262. Yanhong TIan, Shaowei Zhao, Chunqing Wang. Characterization of Ag Nanofilm Metallization on Copper Chip Interconnect and Its Ultrasonic Bondability. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 200963. Shihua Yang,Yanhong Tian , Chunqing Wang, Tengfei Huang. Modeling Thermal Fatigue in Anisotropic Sn-Ag-Cu/Cu Solder Joints. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 200964. Rong An, Chunqing Wang, Yanhong Tian. Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 200965. Wei Liu, Chunqing Wang, Lining Sun, Yanhong Tian, Yarong Chen. Effect of Cu Addition in Sn-containing Solder Joints on Interfacial Reactions with Au Foils. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 200966. Yanhong Tian, Chunqing Wang, Pengrong Lin, Shihua Yang. Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder Joints on Cu Pads with Differeint Solder Volumes. ICEPT-HDP 2008, Shanghai, July 28-31,200867. Tian Dewen; Wang Chunqing; Tian Yanhong. Numerical simulation of solder spreading and solidification during solder jet bumping process. Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 200868. Yang Shihua; Wang Chunqing; Tian Yanhong; Lin Pengrong; Liang Le.Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints. Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 200869. Rong An, Chunqing Wang,Yanhong Tian . First-principles Study on the Elastic Anisotropy of Au-Sn Intermetallic Compounds. ICEPT-HDP 2008, Shanghai, July 28-31,200870. Yanhong Tian, Chunjin Hang, Chunqing Wang, Y. Zhou, Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process, ICEPT 200771. Wei Zhang, Chunqing Wang,Yanhong Tian , Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering, ICEPT 200772. R. An, C. Q. Wang, Y. H. Tian，Elastic Property of Cu3Sn Determined by a First-Principles Calculation on the Basis of its Crystal Substructure. ICEPT 200773. Chao Zeng, Chunqing Wang,Yanhong Tian , Lingchao Kong, The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept, ICEPT 200774. Yang Shihua, Lin Pengrong, Tian Yanhong, Wang Chunqing, Liang Le and Wang Qian, Effect of Solder Volume on Shear Strength between Sn-3.0Ag-0.5Cu Solder and Cu Metallization, ICEPT 200775. Dewen Tian, Chunqing Wang, Yanhong Tian, A Computational Model of a Molten Solder Droplet Spreading on Orthogonal Pads, ICEPT 200776. Wei Liu, Chunqing Wang,Yanhong Tian , Lingchao Kong, Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process. ICEPT 200777. Rong An, Chunqing Wang and Yanhong Tian. Investigation of Tin Atomic Migration of Tin-based Solders with Cluster Model and DV-Xa Method in Electromigration, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China: 829-83278. Dewen Tian, Chunqing Wang, Yanhong Tian, and Hongtao Chen. Prediction of Micro Pitch Motion of a Microsensor Component during Laser Soldering Interconnection Process, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China79. Wei Zhang, Chunqing Wang, Yanhong Tian. Numerical and Experimental Study on Solder Joint Self-Alignment for Optical Fiber Attachment Assembly, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China80. 田艳红，杭春进，王春青，Cu丝超声球焊及楔焊焊点可靠性及失效机理研究，电子工艺技术，2006年第2期(27卷)81. 王春青，田艳红，孔令超，电子封装与组装无铅化应用中的问题，半导体行业协会第四届电子封装测试与市场研讨会，成都，2006年5月16-17日82. Zhang Wei, Wang Chunqing, Tian Yanhong, Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 200583. Yarong Chen, Yanhong Tian, Chunqing Wang , Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 200584. Yanhong Tian , Jicheng Gong, Chunqing Wang, Norman Y. Zhou. Finite Element Modeling of Residual Stress and Distortion in Electron Beam Welding of 6061 Aluminum . International Conference on Joining of Advanced and Specialty Materials VII, October , 2004 ASM Materials Solutions Conference, Columbus, USA85. Liu Wei; Wang Chunqing; Li Mingyu; Tian Yanhong; Guan Jingwei. The effects of laser reflow conditions on the formation of intermetallic compounds at Sn3.0Ag0.5Cu Solder/Cu joint interface, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP04, 2004, p 70-7386. Xiaodong Zhang, Chunqing Wang, Yanhong Tian. Design of Laser Scanning Solder Bumping System. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp141-14487. Yanhong Tian, Chunqing Wang, Jicheng Gong. Characteritics of Interfacial Microstructure of PBGA Solder Bump during Multi-Reflow and Aging Processes. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp26088. Ying Ding, Chunqing Wang, Yanhong Tian. Experimental Research on Reliability of Relfowed Through-Hole Solder Joints. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp 37789. Fuquan Li, Chunqing Wang, Yanhong Tian. Laser Ink-jet Solder BUmp Fabrication for Electronic Interconnection. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp 47690. Yanhong Tian, Chunqing Wang, C. K. Pater, and Deming Liu, Evolution of Intermetallic Compounds at Interface Between PBGA Solder Ball and Pads During Laser Reflow Soldering,2002 Internal Conference on Electronic Materials and Packaging (EMAP2002),December 3-6, 2002, Kaohsuing, Taiwan91. Yanhong Tian, Chunqing Wang, (HIT),Deming Liu ( ASM),Thermalmechanical Behavior of PBGA Package During Laser and Hot Air Reflow Soldering, 2002 Internal Conference on Electronic Materials and Packaging (EMAP2002),December 3-6, 2002, Kaohsuing, Taiwan92. Chunqing Wang, Mingyu Li and Yanhong Tian, Invited Lecture:Interconnection Technology in Electronic Packaging and Assembly,Intelligent Technology in Welding and Joining for the 21st Century, International Welding/Joining Conference-Korea 200293. Yanhong Tian and Chunqing Wang, Experimental Study on Laser and Hot Air Reflow Soldering of PBGA Solder Ball,Intelligent Technology in Welding and Joining for the 21st Century, International Welding/Joining Conference-Korea 200294. Tian Yanhong, Wang Chunqing. INTERFACIAL REACTION BETWEEN PBGA SOLDER BALLS AND Au/Ni/Cu PAD DURING LASER REFLOW BUMPING, Proceedings of IPACK01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 8–13, 2001, Kauai, Hawaii, USA95. Tian Yanhong, Wang Chunqing, FEM Simulation on Thermomechanical Response of PBGA Package during Laser and Hot Air Reflow Bumping, ISEPT, 2001,CPMT IEEE, August 2001 在读博士研究生 名称 2024 吴芃 博士课题：高密度封装可靠性热-电-力多场耦合多尺度模拟 2024 王韬涵 博士课题：多芯粒封装可靠性多场耦合机器学习 2023 梁建超 博士课题：高强高韧无铅钎料开发 2023 王玮 博士课题：高强高韧无铅钎料开发 2023 于沐赢 博士课题：高密度封装可靠性数字孪生 2022 王凯枫 博士课题：高密度封装Chiplet封装互连多场耦合力学行为 2022 王一平 博士课题：第三代半导体新型互连材料开发及可靠性 2021 李庚 博士课题： 柔性可穿戴器件气溶胶打印及集成 2021 吴卓寰（女） 博士课题： 氧化石墨烯集柔性自发电器件制备 2020 撒子成 博士课题： 三维系统级封装超高密度铜柱Copper Pillar 互连 2020 马竟轩 博士课题：柔性器件电流体喷印制备 2020 王 帅 博士课题：新型低温焊料开发及电迁移可靠性在线监测 2019 冯 艳（女） 博士课题：柔性电池印刷制备 2018 杨东升 博士课题：射频芯片封装系统集成 毕业博士研究生 名称 201909：张贺 课题：柔性电致变色器件制备 2023年4月毕业 香港 201709：赵厢汐 课题：Sn基钎料低温冲击性能及断裂行为， 202309毕业，南京 201709：许继开 课题：第三代半导体SiC 晶圆键合 202106 毕业 上海 201609： 冯佳运 课题：自供电柔性湿气传感器制备及性能 202110 留校任教 201609： 文嘉玥 课题：纳米导电浆料及柔性器件 2020年 哈工大郑研院 201509： 王 尚 课题：金属纳米线制备及柔性电子器件，201907，留校任教 201509：黄亦龙 课题：纳米线柔性电极制备及在OLED应用，201909毕业，南京 201409：田茹玉（女）课题： 深空极限环境下Sn基钎料低温力学行为及失效机理，201905毕业，哈工大郑研院 201303：刘宝磊 课题：三维封装金属间化合物焊点性能调控及电迁移失效机理，2017年毕业，上海 201203：丁 苏 （女） 课题：纳米Cu线透明电极光辐照快速制备及性能表征，2016年毕业，大学任教 硕士研究生 名称 2023 朱凯宁 论文方向： 高强高韧无铅钎料开发 2023 邰湾 论文方向： 电子封装可靠性 2023 刘鹏森 论文方向： 电子封装长期贮存可靠性 2023 冯钊 论文方向：柔性传感器件制备 2023 刘旭东 论文方向：超细纳米孪晶铜焊点性能调控 2022 王韬涵 论文方向：三维系统级封装Chiplet可靠性机器学习 2022 吴芃（女）论文方向：纳米浆料烧结行为及物理性能多尺度模拟 2022 孟繁舟 论文方向：柔性可穿戴传感器件 2022 李嘉琪 论文方向：高密度封装可靠性跨尺度模拟 2021 王玮 （女）论文方向： 系统级封装互连可靠性尺度效应 2021 于沐赢 论文方向：电子元器件可靠性评估 2020 胡轩溢 论文方向：柔性器件RFID印刷制备 2020 唐威豪 论文方向：电子元器件高速冲击可靠性 2020 王凯枫 论文方向： 纳米浆料制备及功率芯片封装 2019 撒子成 直博 2019 马竟轩 直博 2018 齐苗苗（女）论文方向：纳米墨水制备及柔性器件，上海 2018 徐佳慧（女）论文方向：射频器件可靠性，上海 2018 吴炳英 论文方向：MEMS器件微电阻焊接工艺及可靠性， 上海 2017 张贺 论文方向：柔性纳米墨水制备及器件，读博 2017 李跃 论文方向：MEMS器件微电阻焊接工艺及可靠性， 上海 2016 黄园（女）论文方向： 三维封装纳米铜柱电沉积制备 南京 2016 肖波 论文方向：电子封装互连焊点极限低温可靠性，北京美的 2016 张悦（女） 论文方向：电子封装湿气存储可靠性模拟 上海 2015 都雪（女）论文方向：电子封装互连焊点极限低温可靠性，长春 2015 郭旭光 论文方向：三维组装互连技术，石家庄 2014 张锐 论文方向：三维组装互连技术，英国读博 2014 赵鑫 论文方向：电子封装互连焊点极限低温可靠性，美国读博 2013 李扬 论文方向：电子封装互连焊点长期存储可靠性，成都 2013 贺晓斌 论文方向：电子封装互连焊点可靠性有限元模拟，上海 2012 秦静凯 论文方向：电子封装互连焊点电迁移可靠性，美国读博 2012 王宁 论文方向：三维封装全IMC互连，苏州 2011 杨东升 论文方向：三维封装全IMC互连，南京 2011 牛丽娜 （女）论文方向：三维封装互连界面金属间化合物表征，石家庄 2010 王宁宁 论文方向：电子封装可靠性，北京 2010 龙博 论文方向：电子封装可靠性，北京 2009 欧阳龚群 论文方向：超声引线键合焊点可靠性评估，北京 友情链接 链接名称 筑5G生态 促共创共利·G客访谈丨田艳红 第三代半导体有望成为我国突围急先锋 链接地址 http://www.hljnews.cn/jjny/content/2022-08/10/content_634132.html 简单介绍 2022年8月9日，出席世界5G大会半导体材料产业创新研讨会的哈尔滨工业大学材料科学与工程学院教授、先进焊接与连接国家重点实验室副主任田艳红阐述了我国半导体产业基础及未来发展的发力点。介绍了我国第三代半导体行业发展还存在一些技术瓶颈，比如芯片制造、封装材料开发及集成封装热管理等方面。与此同时，哈工大在半导体器件材料、封装等方面都具有很好的基础，哈工大的微电子系及材料学院的先进焊接与连接国家重点实验室的微电子封装都有很好的技术积累。田艳红教授说，此次世界5G大会的举行，我们能够跟更多的产业界专家和行业界专家进行交流合作，从而更好地推动第三代半导体在黑龙江产业发展。 链接名称 【对话未来】教授接待日专题活动第9期成功举办：田艳红教授——“芯片制造及先进封装技术” 链接地址 http://today.hit.edu.cn/article/2022/12/13/100127 简单介绍 材料学院田艳红教授作了题为“芯片制造及先进封装技术”的专题讲座。田艳红教授介绍了集成电路发展历史、芯片制造工艺及先进封装技术、柔性可穿戴传感领域最新进展，以及芯片制造领域亟待突破的关键技术瓶颈和未来发展方向。讲座后，李洪震同学表示，他对芯片技术有了进一步的了解，明白了小小的芯片含有的先进技术，也了解了我国芯片技术的现状，希望国家的芯片技术能进一步发展。蒋梦圆同学表示，对于世界及我国芯片技术和封装技术有了一定的了解，也让我们看到了国家被卡脖子的地方，很多都是高科技技术，如果这些技术不能得到很好的进步，我国科技会受到很大的限制，因此我们当代大学生应努力学习，在自己的专业领域内为国家的发展贡献一份力量。曾江涛同学表示，了解到我校是全国第一批开设电子封装专业的高校，具有强大的科研实力和世界先进的实验室，学校具有为国奉献一切的决心，将国家的卡脖子问题铭记于心，矢志不渝致力于攻克难题，学校强大的工科实力，致力于培养优秀的人才，解决我国面临的芯片难题，从电封这个全新的角度，解决现在面临的问题。田教授的讲座，对于他专业的选择有很大影响，对他的家国情怀也有很大熏陶。印哲珂同学表示，学到了关于芯片的相关知识，激发了他为祖国芯片制造做贡献的热情...... 链接名称 MSE讲坛】第102期：电子封装专业介绍会 链接地址 http://today.hit.edu.cn/article/2022/10/04/98338 简单介绍 为助力我院学子探索专业领域前沿，激发科研学习热情，9月29日晚18:30，材料学院2119002班班主任修子扬老师邀请先进焊接与连接国家重点实验室副主任田艳红教授为同学们带来以“芯片制造及先进封装技术”为主题的电子封装专业介绍会。 友情链接 链接名称 新一波太空“快递”来啦，哈工大保驾护航！ 链接地址 https://mp.weixin.qq.com/s/OYCfGiRgBgnMkhTTNhH1Qw 简单介绍 材料学院田艳红教授团队突破了国产星载计算机核心器件在复杂环境下的全生命周期寿命预测技术，大幅缩短了器件可靠性评价周期，节约了测试成本，并实现了天线子系统和太阳能帆板核心组件封装工艺优化与可靠性评估，助力天舟五号货运飞船在轨稳定运行。上述技术还应用于嫦娥系列、天问系列载荷、东方红系列卫星平台等航天装备中，保障了国产核心电子器件在复杂服役环境下的可靠运行。 友情链接 链接名称 航天五院致信感谢我校科研团队助力“天问一号”成功完成着陆火星、巡视任务 链接地址 http://news.hit.edu.cn/2021/0906/c1510a221905/page.htm 简单介绍 哈工大全媒体（材料/文）近日，中国航天科技集团有限公司第五研究院火星探测项目办公室给我校发来感谢信，感谢我校材料学院杭春进、田艳红等科研人员为“天问一号”成功着陆火星任务作出的贡献，希望双方继续携手为我国后续深空探测任务作出更大贡献。2021年5月15日，“天问一号”探测器成功着陆火星，实现了我国首次地外行星着陆，迈出了我国星际探测征程的重要一步，在火星上首次留下中国人的印迹，这是我国航天事业发展的又一具有里程碑意义的进展。在火星着陆、巡视过程中导航控制系统至关重要，面临的极端高低温严酷环境对控制系统电子装备可靠性提出极高要求，直接关系到任务成败。在“天问一号”探测器研制阶段，我校杭春进、田艳红等对极端温度环境下电子互连材料及焊点可靠性进行了系统性研究，并对“天问一号”进入舱、巡视器计算机中核心电路板进行了系统性可靠性评估，为控制系统电子装备的优化设计和制造提供了重要理论与实验支撑，有力保障了我国首次火星着陆、巡视任务的顺利开展，为“天问一号”着陆火星任务的成功作出了贡献。 友情链接 链接名称 【智汇材苑大讲堂】“先进芯片封装与柔性电子”成功举办 链接地址 http://today.hit.edu.cn/article/2021/08/12/88128 简单介绍 2021年7月16日下午14点，由材料学院主办的智汇材苑大讲堂第七期第四讲在邵馆205报告厅顺利举行。先进焊接与连接国家重点实验室副主任、博士研究生导师田艳红教授为19级材料学院学生们带来了主题为“先进芯片封装与柔性电子”的专题讲座。 友情链接 链接名称 【智汇材苑大讲堂】“微纳连接与电子封装最新进展”成功举办 链接地址 http://today.hit.edu.cn/article/2019/07/27/69370 简单介绍 2019年7月17日下午2:00，由材料学院举办的“智汇材苑大讲堂”第五期第十讲“微纳连接与电子封装最新进展”在邵逸夫科学馆205报告厅成功举办。先进焊接与连接国家重点实验室副主任、博士研究生导师田艳红教授担任本次讲座的嘉宾，材料学院国际暑期学校学员与17级本科生共同参与了讲座。 友情链接 链接名称 【名师专业行】正青春宣讲团田艳红教授走进17级焊接专业 链接地址 http://today.hit.edu.cn/article/58022 简单介绍 为了帮助同学们进一步了解焊接与电封专业，同时帮助焊接专业的同学们在心态上适应好未来的科研生活，2018年 7月24日14:00在二区主楼B111，正青春宣讲团教师代表田艳红教授做客17级焊接专业，为同学们讲述专业和实验室，并结合自身经历讲述科研之美。辅导员马慧文老师与17级焊接专业的全体同学参加了本次讲座。 友情链接 链接名称 田艳红教授担任第18届电子封装技术国际学术会议技术委员会主席 链接地址 http://weld.hit.edu.cn/2018/0102/c1648a197795/page.psp 简单介绍 2017年8月16至19日，我实验室承办的第十八届电子封装技术国际会议（ICEPT 2017）在哈尔滨太阳岛花园酒店成功召开。来自中国、美国、英国、日本、韩国等22个国家的各科研院所、高校及企业的600余位科研人员参加了本届会议。8月16日上午，来宾签到。下午，美国Indium公司副主席Ning-Cheng Lee博士, Henkel公司副主席Daniel Lu博士，香港中文大学的Ching-Ping (C.P.) Wong教授，香港ASMPT主席John H. Lau博士，中国华天科技CTO Daquan Yu博士，美国Microsemi公司会员Richard Rao博士等人为嘉宾们作了其相关领域的职业发展课程报告，分享最前沿的学术、产业动态。8月17日，第十八届电子封装技术国际会议（ICEPT 2017）在哈尔滨太阳岛花园酒店正式开幕。本届会议由中国电子学会、中国科学院微电子所、国际电气电子工程师联合会电子元件封装和生产技术学会（IEEE-CPMT）、中国电子学会电子制造与封装技术分会（CIE-EMPT）以及哈尔滨工业大学主办，由哈尔滨工业大学先进焊接与连接国家重点实验室承办。哈尔滨工业大学王春青教授任大会组织委员会主席，田艳红教授任技术委员会主席，刘威副教授任大会秘书长。 友情链接 链接名称 田艳红老师做客第十六期“师说新语”茶苑讲堂 链接地址 http://today2.hit.edu.cn/news/2016/05-12/4573641150RL0.htm 简单介绍 2016年5月10日晚材料学院田艳红老师受邀来到“师说新语”茶苑讲堂第十六期，品茶悟师说，谈笑知新语。此次的茶会主题是“从工程研究发现科学之美”。 友情链接 链接名称 田艳红教授主持焊接“火花”研究生学术论坛 链接地址 http://weld.hit.edu.cn/2e/41/c1649a142913/page.psp 简单介绍 2015年5月13日由先进焊接与连接国家重点实验室、焊接技术与工程系主办的第一届焊接“火花”研究生学术论坛在材料科学与工程学院322会议室成功召开。 本次论坛的主题为石墨烯相关材料的设计、合成及应用，以及新材料制备、加工等相关研究。活动的宗旨为“促进交流 碰撞火花 崇尚创新 弘扬务实”，意在开拓焊接专业研究生的研究视野的同时，为他们搭建展示、交流的平台，通过研讨、分析，帮助解决课题研究过程中的各种困惑、难题，达到激发灵感和创新的火花、促进多学科交叉和融合、提高研究能力和水平的目的。 招生信息 名称 招收材料科学与工程学科、微纳加工、微电子、物理及化学学科、软件工程、机器学习方向博士研究生3~4名，硕士研究生4~6名。联系方式：tianyh@hit.edu.cn