李海龙

李海龙 教师名称：李海龙 教师拼音名称：Li Hailong 出生日期：1984-02-18 性别：男 职称：讲师 其他联系方式 邮箱：dragoneptech@163.com 基本信息 研究方向 获奖情况 论文成果 Areas of research interest1. Electronics Packaging Technology< br>2. Micro-/Nano-Joining Technology< br>3. Reliability Testing and Analysis< br>4. Numerical SimulationSelected publications (Journal articles, patents and books)[1]Hailong Li, Rong An, Chunqing Wang, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Mater Lett, 2015, 158(0): 252-4.< br>[2]Hailong Li, Rong An, Chunqing Wang, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. J Alloy Compd, 2015, 634(0): 94-8.< br>[3]Hailong Li, Rong An, Chunqing Wang, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Mater Lett, 2015, 144(0): 97-9. Electronics Packaging Technology 暂无内容 暂无内容 教育经历 2005.9-2009.7 Harbin Institute of Technology   Welding Science and Engineering   学士 2009.9-2011.7 Harbin Institute of Technology   Materials Processing Engineering   硕士 2011.9-2015.10 Harbin Institute of Technology   Materials Processing Engineering   博士 工作经历 2015.12 -2019.12 |School of Materials Science and Engineering|Tianjin University|Lecturer