周永存

个人经历 Personal experience 教育经历      2014.09-至今 西北工业大学 特评副教授     2012.12-2014.01  美国佐治亚理工学院（Georgia Tech） 访问学者          2014.09  西安交通大学微电子学与固体电子学专业获工学博士学位     2008.07  西安电子科技大学材料科学与工程专业获工学学士学位

教育教学

教育教学 Education and teaching 招生信息      欢迎具有材料、化学、物理、电子电气等其一或交叉背景的优秀学生报考博士或硕士研究生!!!

荣誉获奖

科学研究 Scientific Research      主要研究方向为高分子纳米功能复合材料结构设计及表面改性，有机-无机相变储能材料，多尺度结构与功能调控及电子封装高导热绝缘热管理界面复合材料等。

科学研究

学术成果 Academic Achievements 近几年代表性成果：☆ 论文  [1] Yongcun Zhou**, Siqi Wu, Yuheng Long, Pengli Zhu, Feixiang Wu, Feng Liu, Vignesh Murugadoss, Williams Winchester, Amit Nautiyal, Zhe Wang**, Zhanhu Guo**. Recent Advances in Thermal Interface Materials. ES Materials & Manufacturing, 2020, 7:4–24.[2] Yongcun Zhou**, Feng Liu, Chia-Yun Chen**. Use of BN-coated copper nanowires in nanocomposites with enhanced thermal conductivity and electrical insulation. Advanced Composites and Hybrid Materials, 2019, 2:46–50.[3] Yongcun Zhou**, Siqi Wu, Feng Liu**. High-performance polyimide nanocomposites with polydopamine-coated copper nanoparticles and nanowires for electronic applications. Materials Letters, 2019, 237:19–21.[4] Yongcun Zhou**, Shihu Yu, Huan Niu, Feng Liu**. Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires. Polymers, 2018, 10(12), 1412.[5] Yongcun Zhou**, Xiao Zhuang, Feixiang Wu, Feng Liu**. High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube. Crystals, 2018, 8(11): 398.[6] Yongcun Zhou, Feng Liu, Hong Wang**. Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review. Polymer Composites, 2017, 38(4):803-813. [7] Yongcun Zhou, Feng Liu**. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings. Applied Physics Letters, 2016, 109(8): 082901.[8] Yongcun Zhou, Zhengping Luo, Xiao Zhuang, Feng Liu**. Multilayer-structured high-performance nanocomposites based on a combination of silver nanoparticles and nanowires. Materials Letters, 2016, 182: 323-327.[9] Yongcun Zhou, Yagang Yao, Chia-Yun Chen, Kyoungsilk Moon, Hong Wang**, Ching-Ping Wong**. The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation. Scientific Reports, 2014, 4: 4779. [10] Yongcun Zhou**, Yining Chen, Hong Wang**, Ching-Ping Wong. Creation of a multilayer aluminum coating structure nanoparticle polyimide filler for electronic applications. Materials Letters, 2014, 119: 64-67. [11] Yongcun Zhou, Hong Wang**. An Al@Al2O3@SiO2/Polyimide composite with multilayer coating structure fillers based on self-passivated aluminum cores. Applied Physics Letters, 2013, 102(13): 132901.[12] Yongcun Zhou, Yuanyuan Bai, Ke Yu, Yan Kang, Hong Wang**. Excellent thermal conductivity and dielectric properties of polyimide composites filled with silica coated self-passivated aluminum fibers and nanoparticles. Applied Physics Letters, 2013, 102(25): 252903. [13] Yongcun Zhou, Lu Wang, Hu Zhang, Yuanyuan Bai, Hong Wang**. Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO2 nanoparticle fillers. Applied Physics Letters, 2012, 101(1): 012903. [14] Yongcun Zhou, Hong Wang**, Lu Wang, Ke Yu, Zude Lin, Li He, Yuanyuan Bai. Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging. Materials Science and Engineering B, 2012, 177(11): 892-896. [15] Yongcun Zhou, Hong Wang**, Feng Xiang, Hu Zhang, Ke Yu, Liang Chen. A poly(vinylidene fluoride) composite with added self-passivated microaluminum and nanoaluminum particles for enhanced thermal conductivity. Applied Physics Letters, 2011, 98(18): 182906.[16] Xiao Zhuang, Yongcun Zhou**, Feng Liu**. A novel 3D sandwich structure of hybrid graphite nanosheets and silver nanowires as fillers for improved thermal conductivity. Materials Research Express, 2017, 4(1): 015018.[17] Pin-Ju Chien, Yongcun Zhou, Kun-Hung Tsai, Phan Duong Hong, Chia-Yun Chen**. Self-formed silver nanoparticles on freestanding silicon nanowire arrays featuring SERS performances. RSC Advances, 2019, 9(45): 26037-26042.[18] Yuanyuan Bai, Yanhui Jiang, Baohong Chen, Choon Chiang Foo, Yongcun Zhou, Feng Xiang, Jinxiong Zhou, Hong Wang**, Zhigang Suo**. Cyclic performance of viscoelastic dielectric elastomers with solid hydrogel electrodes, Applied Physics Letters, 2014, 104(6): 062902. [19] Yong Li, Longlong Shu, Yongcun Zhou, Jing Guo, Hong Wang**. Enhanced flexoelectric effect in a non-ferroelectric composite. Applied Physics Letters, 2013, 103(14): 142909.[20] Ke Yu, Yuanyuan Bai, Yongcun Zhou, Yujuan Niu, Hong Wang**. Poly(vinylidene fluoride) polymer based nanocomposites with enhanced energy density by filling with polyacrylate elastomers and BaTio3 nanoparticles. Applied Physics Letters, 2014, 104(8): 082904. [21] Ke Yu, Yujuan Niu, Yuanyuan Bai, Yongcun Zhou, Hong Wang**. Poly(vinylidene fluoride) polymer based nanocomposites with significantly reduced energy loss by filling with core-shell structured BaTiO3/SiO2 nanoparticles. Applied Physics Letters, 2013, 102(10): 102903.[22] Ke Yu, Lu Wang, Yongcun Zhou, Yuanyuan Bai, Hong Wang**. Enhanced dielectric properties of BaTiO3/poly(vinylidene fluoride) nanocomposites for energy storage applications. Journal of Applied Physics, 2013, 113(3): 034105.[23] Ke Yu, Yujuan Niu, Yongcun Zhou, Hong Wang**. Nanocomposites of surface-modified BaTiO3 nanoparticles filled ferroelectric polymer with enhanced energy density. Journal of the American Ceramic Society, 2013, 96(8): 2519-2524. [24] Ke Yu, Yujuan Niu, Feng Xiang, Yongcun Zhou, Yuanyuan Bai, Hong Wang**. Enhanced electric breakdown strength and high energy density of barium titanate filled polymer nanocomposites. Journal of Applied Physics, 2013, 114(17): 174107.  ☆ 专利   [1]   周永存, 吴思奇，甄诚，于是乎. 一种聚合物基电子封装复合材料. 中国发明专利: 201811494536.8[2]   周永存, 甄诚，吴思奇，于是乎. 一种聚合物基封装复合材料的成型设备. 中国发明专利: 201811495615.0[3]   周永存, 庄晓，刘峰. 一种聚合物基纳米复合材料及其制备方法. 中国发明专利: 2017111268026.4[4]   汪宏, 周永存, 向锋, 李可铖, 喻科, 陈惠如. 聚合物基复合材料及其制造方法. 中国发明专利: zl 201110054346.6[5]   向锋, 汪宏, 李可铖, 刘维红, 喻科, 周永存. 一种核壳结构填料聚合物基复合材料及其制备方法. 中国发明专利：zl 200910218645.1[6]   汪宏, 周永存, 向锋, 喻科, 王鲁. 一种聚合物基复合材料及其制备方法. 中国发明专利: 201210182048.x[7]   汪宏, 喻科, 牛玉娟, 周永存, 陈惠如. 聚合物基复合材料及其制备方法. 中国发明专利: 201310115602.7[8]   刘峰, 周永存, 罗正平, 庄晓. 一种聚合物基复合材料及其制备方法. 中国发明专利: 201610537556.3

学术成果

社会兼职 Social Appointments 美国化学学会(ACS)会员；光电材料器件网专家委员会专家委员；电子信息材料与器件专家委员会委员；Composite Materials Research, Materials Science: Advanced Composite Materials 等期刊编委；IEEE会员；中国复合材料学会纳米复合材料委员会委员

综合介绍

综合介绍 General Introduction        周永存，博士，副教授。2014年毕业于西安交通大学，获工学博士学位。2012年至2014年于美国佐治亚理工学院(Georgia Tech)从事电子封装复合材料的研究，师从“现代电子封装之父”C. P. Wong 教授。2014年9月特评副教授进入西北工业大学材料学院工作，主要从事聚合物基纳米复合封装材料及结构-功能一体化研究。目前主持国家自然科学基金、陕西省自然科学基金面上项目、中央高校基础研究基金以及国家重点实验室开放课题等多项基金，已在国际期刊权威期刊上发表SCI论文30余篇，包括Nature旗下综合期刊Scientific Reports, Polymers，Applied Physics Letter等，SCI他引800余次，H因子16，已申请/授权发明专利9项。  个人相册